PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
SN74F138DRG4
SN74F138N
ACTIVE
SOIC
PDIP
D
16
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
F138
ACTIVE
N
25
Pb-Free
(RoHS)
N / A for Pkg Type
0 to 70
SN74F138N
SN74F138N3
OBSOLETE
ACTIVE
PDIP
PDIP
N
N
16
16
TBD
Call TI
Call TI
0 to 70
0 to 70
SN74F138NE4
25
2000
2000
2000
1
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74F138N
74F138
SN74F138NSR
SN74F138NSRE4
SN74F138NSRG4
SNJ54F138FK
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
SO
NS
NS
NS
FK
16
16
16
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
POST-PLATE
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
0 to 70
0 to 70
Green (RoHS
& no Sb/Br)
74F138
SO
Green (RoHS
& no Sb/Br)
0 to 70
74F138
LCCC
TBD
-55 to 125
5962-
9758201Q2A
SNJ54F
138FK
SNJ54F138J
SNJ54F138W
ACTIVE
ACTIVE
CDIP
CFP
J
16
16
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
5962-9758201QE
A
SNJ54F138J
W
5962-9758201QF
A
SNJ54F138W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Addendum-Page 2