生命周期: | Active | 零件包装代码: | DFP |
包装说明: | DFP, | 针数: | 36 |
Reach Compliance Code: | unknown | ECCN代码: | 3A001.A.2.C |
HTS代码: | 8542.32.00.41 | 风险等级: | 5.8 |
最长访问时间: | 25 ns | JESD-30 代码: | R-CDFP-F36 |
JESD-609代码: | e4 | 长度: | 23.365 mm |
内存密度: | 4194304 bit | 内存集成电路类型: | STANDARD SRAM |
内存宽度: | 8 | 功能数量: | 1 |
端子数量: | 36 | 字数: | 524288 words |
字数代码: | 512000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
组织: | 512KX8 | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | DFP | 封装形状: | RECTANGULAR |
封装形式: | FLATPACK | 并行/串行: | PARALLEL |
认证状态: | Qualified | 筛选级别: | MIL-STD-883 |
座面最大高度: | 3.18 mm | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | MILITARY | 端子面层: | GOLD |
端子形式: | FLAT | 端子节距: | 1.27 mm |
端子位置: | DUAL | 宽度: | 12.955 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
5962-9561322HNC | MICROSS |
获取价格 |
Standard SRAM, 512KX8, 25ns, CMOS, CDSO36, CERAMIC, LCC-36 | |
5962-9561322HUA | MICROSS |
获取价格 |
Standard SRAM, 512KX8, 25ns, CMOS, CDFP36, CERAMIC, DFP-36 | |
5962-9561323H9C | MICROSS |
获取价格 |
Standard SRAM, 512KX8, 20ns, CMOS, CDFP32, CERAMIC, DFP-32 | |
5962-9561323HZA | MICROSS |
获取价格 |
Standard SRAM, 512KX8, 20ns, CMOS, CDSO36, CERAMIC, SOJ-36 | |
5962-9561323HZC | MICROSS |
获取价格 |
Standard SRAM, 512KX8, 20ns, CMOS, CDSO36, CERAMIC, SOJ-36 | |
5962-9561324H9A | MICROSS |
获取价格 |
Standard SRAM, 512KX8, 17ns, CMOS, CDFP32, CERAMIC, DFP-32 | |
5962-9561324HMC | MICROSS |
获取价格 |
Standard SRAM, 512KX8, 17ns, CMOS, CDSO32, CERAMIC, LCC-32 | |
5962-9561324HNC | MICROSS |
获取价格 |
Standard SRAM, 512KX8, 17ns, CMOS, CDSO36, CERAMIC, LCC-36 | |
5962-9561324HTA | MICROSS |
获取价格 |
Standard SRAM, 512KX8, 17ns, CMOS, CDSO32, CERAMIC, SOJ-32 | |
5962-9561324HTC | MICROSS |
获取价格 |
Standard SRAM, 512KX8, 17ns, CMOS, CDSO32, CERAMIC, SOJ-32 |