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5962-9458501H9C PDF预览

5962-9458501H9C

更新时间： 2024-02-27 09:34:58
品牌 Logo 应用领域
其他 - ETC 内存集成电路可编程只读存储器电动程控只读存储器电可擦编程只读存储器
页数 文件大小 规格书
42页 374K
描述
EEPROM

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中文翻译

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5962-9458501H9C 技术参数

生命周期：Active零件包装代码：QFP
包装说明：CERAMIC, QFP-68针数：68
Reach Compliance Code：unknownECCN代码：3A001.A.2.C
HTS代码：8542.32.00.51风险等级：5.24
Is Samacsys：N最长访问时间：300 ns
其他特性：USER CONFIGURABLE AS 512K X 8备用内存宽度：16
JESD-30 代码：S-CQFP-G68长度：23.875 mm
内存密度：4194304 bit内存集成电路类型：EEPROM MODULE
内存宽度：32功能数量：1
端子数量：68字数：131072 words
字数代码：128000工作模式：ASYNCHRONOUS
最高工作温度：125 °C最低工作温度：-55 °C
组织：128KX32封装主体材料：CERAMIC, METAL-SEALED COFIRED
封装代码：QFP封装形状：SQUARE
封装形式：FLATPACK并行/串行：PARALLEL
编程电压：5 V认证状态：Qualified
筛选级别：MIL-STD-883座面最大高度：3.56 mm
最大供电电压 (Vsup)：5.5 V最小供电电压 (Vsup)：4.5 V
标称供电电压 (Vsup)：5 V表面贴装：YES
技术：CMOS温度等级：MILITARY
端子形式：GULL WING端子节距：1.27 mm
端子位置：QUAD宽度：23.875 mm
最长写入周期时间 (tWC)：10 msBase Number Matches：1

5962-9458501H9C 数据手册

 浏览型号5962-9458501H9C的Datasheet PDF文件第1页浏览型号5962-9458501H9C的Datasheet PDF文件第3页浏览型号5962-9458501H9C的Datasheet PDF文件第4页浏览型号5962-9458501H9C的Datasheet PDF文件第5页浏览型号5962-9458501H9C的Datasheet PDF文件第6页浏览型号5962-9458501H9C的Datasheet PDF文件第7页 
1. SCOPE  
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A  
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When  
available, a choice of radiation hardness assurance levels are reflected in the PIN.  
1.2 PIN. The PIN shall be as shown in the following example:  
5962  
-
94585  
01  
H
M
X
Federal  
stock class  
designator  
RHA  
designator  
(see 1.2.1)  
Device  
type  
(see 1.2.2)  
Device  
class  
designator  
(see 1.2.3)  
Case  
outline  
(see 1.2.4)  
Lead  
finish  
(see 1.2.5)  
\
/
\/  
Drawing number  
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA  
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.  
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:  
Device type  
Generic number  
Circuit function  
Access time  
01  
02  
03  
04  
05  
06  
07  
08  
09  
WE128K32-300HQ, ACT-E128K32N-300P7Q, AS8E128K32-300/883C  
WE128K32-250HQ, ACT-E128K32N-250P7Q, AS8E128K32-250/883C  
WE128K32-200HQ, ACT-E128K32N-200P7Q, AS8E128K32-200/883C  
WE128K32-150HQ, ACT-E128K32N-150P7Q, AS8E128K32-150/883C  
WE128K32-140HQ, ACT-E128K32N-140P7Q, AS8E128K32-140/883C  
WE128K32-120HQ, ACT-E128K32N-120P7Q, AS8E128K32-120/883C  
AS8ER128K32Q-250/883C  
EEPROM, 128K x 32-bit  
EEPROM, 128K x 32-bit  
EEPROM, 128K x 32-bit  
EEPROM, 128K x 32-bit  
EEPROM, 128K x 32-bit  
EEPROM, 128K x 32-bit  
EEPROM, 128K x 32-bit  
EEPROM, 128K x 32-bit  
EEPROM, 128K x 32-bit  
300 ns  
250 ns  
200 ns  
150 ns  
140 ns  
120 ns  
250 ns  
200 ns  
150 ns  
AS8ER128K32Q-200/883C  
AS8ER128K32Q-150/883C  
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.  
All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,  
and E) or QML Listing (Class G and D). The product assurance levels are as follows:  
Device class  
K
Device performance documentation  
Highest reliability class available. This level is intended for use in space  
applications.  
H
G
Standard military quality class level. This level is intended for use in applications  
where non-space high reliability devices are required.  
Reduced testing version of the standard military quality class. This level uses the  
Class H screening and In-Process Inspections with a possible limited temperature  
range, manufacturer specified incoming flow, and the manufacturer guarantees (but  
may not test) periodic and conformance inspections (Group A, B, C and D).  
E
Designates devices which are based upon one of the other classes (K, H, or G)  
with exception(s) taken to the requirements of that class. These exception(s) must  
be specified in the device acquisition document; therefore the acquisition document  
should be reviewed to ensure that the exception(s) taken will not adversely affect  
system performance.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-94585  
A
REVISION LEVEL  
SHEET  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
H
2
DSCC FORM 2234  
APR 97  
1234567...42

中文翻译

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