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5962-9317704VUA PDF预览

5962-9317704VUA

更新时间: 2024-02-13 22:14:36
品牌 Logo 应用领域
TEMIC 先进先出芯片
页数 文件大小 规格书
19页 357K
描述
FIFO, 16KX9, 15ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28

5962-9317704VUA 技术参数

生命周期:Obsolete包装说明:DIP,
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.71风险等级:5.7
最长访问时间:15 ns周期时间:25 ns
JESD-30 代码:R-CDIP-T28JESD-609代码:e4
内存密度:147456 bit内存宽度:9
功能数量:1端子数量:28
字数:16384 words字数代码:16000
工作模式:ASYNCHRONOUS最高工作温度:125 °C
最低工作温度:-55 °C组织:16KX9
可输出:NO封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:DIP封装形状:RECTANGULAR
封装形式:IN-LINE并行/串行:PARALLEL
认证状态:Not Qualified筛选级别:MIL-PRF-38535 Class V
座面最大高度:5.84 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:NO技术:CMOS
温度等级:MILITARY端子面层:GOLD
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL宽度:7.62 mm
Base Number Matches:1

5962-9317704VUA 数据手册

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Expansion Out/Half-Full  
Flag (XO/HF)  
This is a dual-purpose output. In the single device mode, when Expansion In (XI) is con-  
nected to ground, this output acts as an indication of a half-full memory.  
After half the memory is filled and on the falling edge of the next write operation, the  
Half-Full Flag (HF) will be set to low and will remain set until the difference between the  
write and read pointers is less than or equal to half of the total memory of the device.  
The Half-Full Flag (HF) is then reset by the rising edge of the read operation.  
In the Depth Expansion Mode, Expansion In (XI) is connected to Expansion Out (XO) of  
the previous device. This output acts as a signal to the next device in the Daisy Chain by  
providing a pulse to the next device when the previous device reaches the last memory  
location.  
Data Output (Q0 - Q8)  
DATA output for 9-bit wide data. This data is in a high impedance condition whenever  
Read (R) is in a high state.  
5
M67206F  
Rev. E20-Aug-01  

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