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5962-9317704VUA PDF预览

5962-9317704VUA

更新时间: 2024-01-28 14:10:35
品牌 Logo 应用领域
TEMIC 先进先出芯片
页数 文件大小 规格书
19页 357K
描述
FIFO, 16KX9, 15ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28

5962-9317704VUA 技术参数

生命周期:Obsolete包装说明:DIP,
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.71风险等级:5.7
最长访问时间:15 ns周期时间:25 ns
JESD-30 代码:R-CDIP-T28JESD-609代码:e4
内存密度:147456 bit内存宽度:9
功能数量:1端子数量:28
字数:16384 words字数代码:16000
工作模式:ASYNCHRONOUS最高工作温度:125 °C
最低工作温度:-55 °C组织:16KX9
可输出:NO封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:DIP封装形状:RECTANGULAR
封装形式:IN-LINE并行/串行:PARALLEL
认证状态:Not Qualified筛选级别:MIL-PRF-38535 Class V
座面最大高度:5.84 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:NO技术:CMOS
温度等级:MILITARY端子面层:GOLD
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL宽度:7.62 mm
Base Number Matches:1

5962-9317704VUA 数据手册

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