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5962-9096501MZX PDF预览

5962-9096501MZX

更新时间: 2024-11-24 14:46:47
品牌 Logo 应用领域
ACTEL 可编程逻辑
页数 文件大小 规格书
25页 216K
描述
Field Programmable Gate Array, 547 CLBs, 2000 Gates, CMOS, CQCC84, CERAMIC, QCC-84

5962-9096501MZX 技术参数

生命周期:Obsolete包装说明:CERAMIC, QCC-84
Reach Compliance Code:unknown风险等级:5.79
其他特性:MAX 69 I/OSCLB-Max的组合延迟:10.8 ns
JESD-30 代码:S-CQCC-J84JESD-609代码:e0
长度:29.21 mm可配置逻辑块数量:547
等效关口数量:2000端子数量:84
最高工作温度:125 °C最低工作温度:-55 °C
组织:547 CLBS, 2000 GATES封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:QCCJ封装形状:SQUARE
封装形式:CHIP CARRIER可编程逻辑类型:FIELD PROGRAMMABLE GATE ARRAY
认证状态:Not Qualified筛选级别:MIL-STD-883
座面最大高度:4.57 mm最大供电电压:5.5 V
最小供电电压:4.5 V标称供电电压:5 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子面层:TIN LEAD
端子形式:J BEND端子节距:1.27 mm
端子位置:QUAD宽度:29.21 mm
Base Number Matches:1

5962-9096501MZX 数据手册

 浏览型号5962-9096501MZX的Datasheet PDF文件第2页浏览型号5962-9096501MZX的Datasheet PDF文件第3页浏览型号5962-9096501MZX的Datasheet PDF文件第4页浏览型号5962-9096501MZX的Datasheet PDF文件第5页浏览型号5962-9096501MZX的Datasheet PDF文件第6页浏览型号5962-9096501MZX的Datasheet PDF文件第7页 
REVISIONS  
LTR  
A
DESCRIPTION  
DATE (YR-MO-DA)  
93-06-23  
APPROVED  
M. A. Frye  
Add device type 02; editorial changes throughout. Redrawn.  
B
Update boilerplate. Add device types 03 and 04. Add case outline M.  
Editorial changes throughout.  
94-06-30  
M. A. Frye  
C
D
Add 05 device. Removed some parameters from table IIB. Updated  
boilerplate. ksr  
98-04-06  
98-07-10  
Raymond Monnin  
Raymond Monnin  
Added equation to footnote 2/, made corrections to table IB. Changed  
sample size in paragraph 4.4.1. Removed (Dose Rate Induced  
latchup testing) and (Dose Rate Upset testing) paragraphs. Updated  
boilerplate. ksr  
E
98-09-21  
Raymond Monnin  
Change 1.3 Maximum junction temperature from 175°C to 150°C.  
Added footnote 2/ to Figure 2 for the T and M case outlines. Add die  
information per Appendix A. ksr  
F
Correct bond pad symbol on figure A-1, pad #45 I/O vs GND. Updated 04-03-08  
boilerplate. ksr  
Raymond Monnin  
Raymond Monnin  
G
Added additional information to footnote 2 on figure 2 Terminal  
connections, for case outlines T and M. Added note 3 to figure A-1  
A1020B and RH1020 Bond Pad Locations and Functions. ksr  
05-05-13  
REV  
SHEET  
REV  
G
G
G
G
G
G
G
21  
G
1
G
22  
G
2
G
23  
G
3
SHEET  
15  
16  
17  
18  
19  
20  
REV STATUS  
OF SHEETS  
REV  
G
4
G
5
G
6
G
7
G
8
G
9
G
G
G
G
G
SHEET  
10  
11  
12  
13  
14  
PMIC N/A  
PREPARED BY  
Tim H. Noh  
DEFENSE SUPPLY CENTER COLUMBUS  
CHECKED BY  
Kenneth Rice  
COLUMBUS, OHIO 43218-3990  
STANDARD  
MICROCIRCUIT  
DRAWING  
http://www.dscc.dla.mil  
APPROVED BY  
Tim H. Noh  
MICROCIRCUIT, MEMORY, DIGITAL,  
THIS DRAWING IS  
AVAILABLE  
FOR USE BY ALL  
CMOS, FIELD PROGRAMMABLE GATE  
ARRAY, 2,000 GATES, MONOLITHIC  
SILICON  
DEPARTMENTS  
AND AGENCIES OF THE  
DEPARTMENT OF DEFENSE  
DRAWING APPROVAL DATE  
92-06-23  
AMSC N/A  
REVISION LEVEL  
G
SIZE  
CAGE CODE  
5962-90965  
67268  
A
SHEET  
1
OF 23  
DSCC FORM 2233  
APR 97  
5962-E336-05  

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