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5962-9089909MZX PDF预览

5962-9089909MZX

更新时间: 2024-01-08 12:11:04
品牌 Logo 应用领域
其他 - ETC 闪存内存集成电路可编程只读存储器电动程控只读存储器电可擦编程只读存储器
页数 文件大小 规格书
27页 208K
描述
MICROCIRCUIT, MEMORY, DIGITAA, CMOS, 128K X 8 BIT FLASH EEPROM, MONOLITHIC SILICON

5962-9089909MZX 技术参数

生命周期:Obsolete零件包装代码:QFP
包装说明:QFP,针数:32
Reach Compliance Code:unknownECCN代码:3A001.A.2.C
HTS代码:8542.32.00.51风险等级:5.74
Is Samacsys:N最长访问时间:90 ns
JESD-30 代码:R-CQFP-G32长度:13.97 mm
内存密度:1048576 bit内存集成电路类型:FLASH
内存宽度:8功能数量:1
端子数量:32字数:131072 words
字数代码:128000工作模式:ASYNCHRONOUS
最高工作温度:125 °C最低工作温度:-55 °C
组织:128KX8封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:QFP封装形状:RECTANGULAR
封装形式:FLATPACK并行/串行:PARALLEL
编程电压:12 V认证状态:Not Qualified
筛选级别:MIL-STD-883座面最大高度:4.04 mm
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:MILITARY
端子形式:GULL WING端子节距:1.27 mm
端子位置:QUAD宽度:11.43 mm
Base Number Matches:1

5962-9089909MZX 数据手册

 浏览型号5962-9089909MZX的Datasheet PDF文件第7页浏览型号5962-9089909MZX的Datasheet PDF文件第8页浏览型号5962-9089909MZX的Datasheet PDF文件第9页浏览型号5962-9089909MZX的Datasheet PDF文件第11页浏览型号5962-9089909MZX的Datasheet PDF文件第12页浏览型号5962-9089909MZX的Datasheet PDF文件第13页 
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain  
the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made  
available onshore at the option of the reviewer.  
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in  
microcircuit group number 41 (see MIL-PRF-38535, appendix A).  
3.11 Processing of EEPROMs. All testing requirements and quality assurance provisions herein shall be satisfied by the  
manufacturer prior to delivery.  
3.11.1 Conditions of the supplied devices. Devices will be supplied in an unprogrammed or clear state. No provision will  
be made for supplying programmed devices.  
3.11.2 Erasure of EEPROMs. When specified, devices shall be erased in accordance with procedures and  
characteristics specified in 4.5.1.  
3.11.3 Programming of EEPROMs. When specified, devices shall be programmed in accordance with procedures and  
characteristics specified in 4.5.2.  
3.11.4 Verification of state of EEPROMs. When specified, devices shall be verified as either written to the specified  
pattern or cleared. As a minimum, verification shall consist of performing a read of the entire array to verify that all bits are in  
the proper state. Any bit that does not verify to be in the proper state shall constitute a device failure and the device shall be  
removed from the lot or sample.  
3.12 Endurance. A reprogrammability test shall be completed as part of the vendor's reliability monitors. This  
reprogrammability test shall be done for initial characterization and after any design or process changes which may affect the  
reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of  
program/erase endurance cycles listed in section 1.3 herein over the full military temperature range. The vendor's procedure  
shall be kept under document control and shall be made available upon request of the acquiring or preparing activity, along  
with test data.  
3.13 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test  
shall be done for initial characterization and after any design or process change which may affect data retention. The  
methods and procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over  
the full military temperature range. The vendor's procedure shall be kept under document control and shall be made  
available upon request of the acquiring or preparing activity, along with test data.  
SIZE  
STANDARD  
5962-90899  
A
MICROCIRCUIT DRAWING  
DEFENSE SUPPLY CENTER COLUMBUS  
REVISION LEVEL  
C
SHEET  
COLUMBUS, OHIO 43216-5000  
10  
DSCC FORM 2234  
APR 97  

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