Datasheet > 5962-8852512XX

5962-8852512XX

更新时间： 2024-02-03 10:47:08

品牌	Logo	应用领域
XICOR		可编程只读存储器电动程控只读存储器电可擦编程只读存储器内存集成电路
页数	文件大小	规格书
28页	238K
描述
EEPROM, 32KX8, 200ns, Parallel, CMOS, CDIP28, CERAMIC, DIP-28

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5962-8852512XX 技术参数

生命周期：	Obsolete	包装说明：	DIP,
Reach Compliance Code：	unknown	风险等级：	5.65
最长访问时间：	200 ns	JESD-30 代码：	R-GDIP-T28
内存密度：	262144 bit	内存集成电路类型：	EEPROM
内存宽度：	8	功能数量：	1
端子数量：	28	字数：	32768 words
字数代码：	32000	工作模式：	ASYNCHRONOUS
最高工作温度：	125 °C	最低工作温度：	-55 °C
组织：	32KX8	封装主体材料：	CERAMIC, GLASS-SEALED
封装代码：	DIP	封装形状：	RECTANGULAR
封装形式：	IN-LINE	并行/串行：	PARALLEL
编程电压：	5 V	认证状态：	Not Qualified
筛选级别：	MIL-STD-883 Class B	座面最大高度：	5.9 mm
最大供电电压 (Vsup)：	5.5 V	最小供电电压 (Vsup)：	4.5 V
标称供电电压 (Vsup)：	5 V	表面贴装：	NO
技术：	CMOS	温度等级：	MILITARY
端子形式：	THROUGH-HOLE	端子节距：	2.54 mm
端子位置：	DUAL	宽度：	15.24 mm
最长写入周期时间 (tWC)：	10 ms	Base Number Matches：	1

5962-8852512XX 数据手册

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535, appendix A and herein.

3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and on figure 1.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.

3.2.3 Truth table(s). See 3.2.3.1 and 3.2.3.2

3.2.3.1 Unprogrammed or erased devices. The truth table for unprogrammed devices shall be as specified on figure 3.

3.2.3.2 Programmed devices. The requirements for supplying programmed devices are not part of this drawing.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are

as specified in table I and shall apply over the full case operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are described in table I.

3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed

in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN

number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.

3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance

to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in

accordance with MIL-PRF-38535 to identify when the QML flow option is used.

3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an

approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to

listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,

appendix A and the requirements herein.

3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided

with each lot of microcircuits delivered to this drawing.

3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.

3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's

facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the

reviewer.

3.10 Processing EEPROMS. All testing requirements and quality assurance provisions herein shall be satisfied by the

manufacturer prior to delivery.

3.10.1 Erasure of EEPROMS. When specified, devices shall be erased in accordance with the procedures and

characteristics specified in 4.4.3.

3.10.2 Programmability of EEPROMS. When specified, devices shall be programmed to the specified pattern using the

procedures and characteristics specified in 4.4.2. Software data protect procedures shall be as specified in 4.4.5.

3.10.3 Verification of erasure or programmability of EPROMS. When specified, devices shall be verified as either programmed

to the specified pattern or erased. As a minimum, verification shall consist of reading the device per the procedures and

characteristics specified in 4.4.4. Any bit that does not verify to be in the proper state shall constitute a device failure, and shall

be removed from the lot.

SIZE

STANDARD

5962-88525

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

SHEET

DSCC FORM 2234

APR 97

1 2 345 6 7...28

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与5962-8852512XX相关器件

型号	品牌	描述	获取价格	数据表
5962-8852512YX	MICROCHIP	EEPROM, 32KX8, 200ns, Parallel, CMOS, CQCC32	获取价格
5962-8852512YX	XICOR	EEPROM, 32KX8, 200ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32	获取价格
5962-8852512ZA	ATMEL	EEPROM, 32KX8, 200ns, Parallel, CMOS, CDFP28, BOTTOM BRAZED, CERAMIC, DFP-28	获取价格
5962-8852512ZC	XICOR	EEPROM, 32KX8, 200ns, Parallel, CMOS, CDFP28, CERAMIC, FP-28	获取价格
5962-8852512ZX	XICOR	EEPROM, 32KX8, 200ns, Parallel, CMOS, CDFP28, CERAMIC, FP-28	获取价格
5962-8852512ZX	MICROCHIP	EEPROM, 32KX8, 200ns, Parallel, CMOS, CDFP28	获取价格

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