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5962-8761901VEA PDF预览

5962-8761901VEA

更新时间: 2024-11-18 12:21:59
品牌 Logo 应用领域
德州仪器 - TI 驱动器接口集成电路
页数 文件大小 规格书
15页 578K
描述
DUAL CHANNEL POWER DRIVER

5962-8761901VEA 技术参数

生命周期:Active零件包装代码:DIP
包装说明:DIP, DIP16,.3针数:16
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.35
高边驱动器:NO输入特性:STANDARD
接口集成电路类型:BUFFER OR INVERTER BASED MOSFET DRIVERJESD-30 代码:R-GDIP-T16
长度:19.56 mm功能数量:2
端子数量:16最高工作温度:125 °C
最低工作温度:-55 °C输出特性:TOTEM-POLE
最大输出电流:1.5 A标称输出峰值电流:1 A
输出极性:TRUE AND INVERTED封装主体材料:CERAMIC, GLASS-SEALED
封装代码:DIP封装等效代码:DIP16,.3
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Qualified
筛选级别:MIL-PRF-38535 Class V座面最大高度:5.08 mm
子类别:MOSFET Drivers最大压摆率:15 mA
最大供电电压:40 V最小供电电压:5 V
标称供电电压:20 V表面贴装:NO
技术:BIPOLAR温度等级:MILITARY
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
总剂量:50k Rad(Si) V断开时间:0.06 µs
接通时间:0.05 µs宽度:7.62 mm
Base Number Matches:1

5962-8761901VEA 数据手册

 浏览型号5962-8761901VEA的Datasheet PDF文件第2页浏览型号5962-8761901VEA的Datasheet PDF文件第3页浏览型号5962-8761901VEA的Datasheet PDF文件第4页浏览型号5962-8761901VEA的Datasheet PDF文件第5页浏览型号5962-8761901VEA的Datasheet PDF文件第6页浏览型号5962-8761901VEA的Datasheet PDF文件第7页 
UC1707-SP  
www.ti.com  
SLUSAG0 MARCH 2011  
DUAL CHANNEL POWER DRIVER  
Check for Samples: UC1707-SP  
1
FEATURES  
J OR W PACKAGE  
(TOP VIEW)  
Rad-Tolerant: 50 kRad (Si) for  
5962-8761903VEA, 5962-8761903VFA  
(1)  
INPUT B INV.  
INPUT B N.I.  
LATCH DISABLE  
GROUND  
1
2
3
4
5
6
7
8
16 INPUT A INV.  
QML-V Qualified, SMD  
(5962-8761901VEA, 5962-8761903VEA,  
5962-8761903VFA, 5962-8761901V2A)  
15  
14  
13  
12  
11  
10  
9
INPUT A N.I.  
+VIN  
GROUND  
GROUND  
GROUND  
Two Independent Drivers  
OUTPUT A  
SHUTDOWN  
+VC  
OUTPUT B  
ANALOG STOP NON-INV.  
ANALOG STOP INV.  
1.5-A Totem Pole Outputs  
Inverting and Non-Inverting Inputs  
40-ns Rise and Fall Into 1000 pF  
High-Speed, Power MOSFET Compatible  
Low Cross-Conduction Current Spike  
Analog Shutdown With Optional Latch  
Low Quiescent Current  
NOTE: All four ground pins must be connected to a  
common ground.  
FK PACKAGE  
(TOP VIEW)  
NC  
INPUT A INV.  
INPUT B INV.  
INPUT B I.N.  
INPUT A NON INV.  
5-V to 40-V Operation  
3
2
1
20 19  
18  
17  
16  
15  
14  
Thermal Shutdown Protection  
16-Pin Dual-In-Line Package  
4
5
LATCH DISABLE  
GROUND  
VIN  
GROUND  
NC  
6
NC  
GROUND  
OUTPUT B  
GROUND  
7
8
OUTPUT A  
9
10 11 12 13  
SHUTDOWN  
VC  
(1) Radiation tolerance is a typical value based upon initial device  
qualification with dose rate = 10 mrad/sec. Radiation Lot  
Acceptance Testing is available - contact factory for details.  
ANALOG STOP INV.  
ANALOG STOP NON INV.  
NC  
DESCRIPTION  
The UC1707 power driver is made with a high-speed Schottky process to interface between low-level control  
functions and high-power switching devicesparticularly power MOSFETs. The UC1707 contains two  
independent channels, each of which can be activated by either a high or low input logic level signal. Each output  
can source or sink up to 1.5 A as long as power dissipation limits are not exceeded.  
Although each output can be activated independently with its own inputs, it can be forced low in common through  
the action either of a digital high signal at the Shutdown terminal or a differential low-level analog signal. The  
Shutdown command from either source can either be latching or not, depending on the status of the Latch  
Disable pin.  
Supply voltage for both VIN and VC can independently range from 5 V to 40 V.  
TRUTH TABLE  
(Each Channel)(1)  
INV.  
H
N.I.  
OUT  
H
L
H
L
L
H
H
L
L
L
L
(1) OUT = INV and N.I.  
OUT = INV or N.I.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
© 2011, Texas Instruments Incorporated  

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