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560

更新时间: 2024-01-02 04:07:23
品牌 Logo 应用领域
英特尔 - INTEL /
页数 文件大小 规格书
96页 1585K
描述
Pentium 4 Processors Supporting Hyper-Threading Technology

560 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:compliantECCN代码:EAR99
Factory Lead Time:13 weeks 6 days风险等级:5.51
Is Samacsys:N其他特性:RATED BREAKING CAPACITY AT 350 VDC: 200000 A
主体高度:50 mm主体长度或直径:83 mm
电路保护类型:ELECTRIC FUSE焦耳积分标称:60000 J
安装特点:INLINE/HOLDER包装方法:BOX
物理尺寸:83mm x 50mm额定分断能力:200000 A
额定电流:560 A额定电压(交流):690 V
额定电压(直流):350 V参考标准:BS 88; CE; IEC; UL
表面贴装:NO端子形状:TAB/BLADE
Base Number Matches:1

560 数据手册

 浏览型号560的Datasheet PDF文件第90页浏览型号560的Datasheet PDF文件第91页浏览型号560的Datasheet PDF文件第92页浏览型号560的Datasheet PDF文件第94页浏览型号560的Datasheet PDF文件第95页浏览型号560的Datasheet PDF文件第96页 
Boxed Processor Specifications  
Figure 7-6. Baseboard Power Header Placement Relative to Processor Socket  
R4.33  
[110]  
B
C
7.3  
Thermal Specifications  
This section describes the cooling requirements of the fan heatsink solution used by the boxed  
processor.  
7.3.1  
Boxed Processor Cooling Requirements  
The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's  
temperature specification is also a function of the thermal design of the entire system, and  
ultimately the responsibility of the system integrator. The processor temperature specification is in  
Chapter 5. The boxed processor fan heatsink is able to keep the processor temperature within the  
specifications (see Table 5-1) in chassis that provide good thermal management. For the boxed  
processor fan heatsink to operate properly, it is critical that the airflow provided to the fan heatsink  
is unimpeded. Airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.  
Airspace is required around the fan to ensure that the airflow through the fan heatsink is not  
blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and decreases fan  
life. Figure 7-7 and Figure 7-8 illustrate an acceptable airspace clearance for the fan heatsink. The  
air temperature entering the fan should be kept below 38 ºC. Again, meeting the processor's  
temperature specification is the responsibility of the system integrator.  
Datasheet  
93  

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