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560

更新时间： 2024-01-14 08:20:38

品牌	Logo	应用领域
英特尔 - INTEL		/
页数	文件大小	规格书
96页	1585K
描述
Pentium 4 Processors Supporting Hyper-Threading Technology

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560 技术参数

是否Rohs认证：	符合	生命周期：	Active
Reach Compliance Code：	compliant	ECCN代码：	EAR99
Factory Lead Time：	13 weeks 6 days	风险等级：	5.51
Is Samacsys：	N	其他特性：	RATED BREAKING CAPACITY AT 350 VDC: 200000 A
主体高度：	50 mm	主体长度或直径：	83 mm
电路保护类型：	ELECTRIC FUSE	焦耳积分标称：	60000 J
安装特点：	INLINE/HOLDER	包装方法：	BOX
物理尺寸：	83mm x 50mm	额定分断能力：	200000 A
额定电流：	560 A	额定电压（交流）：	690 V
额定电压（直流）：	350 V	参考标准：	BS 88; CE; IEC; UL
表面贴装：	NO	端子形状：	TAB/BLADE
Base Number Matches：	1

560 数据手册

Boxed Processor Specifications

Table 7-2. Fan Heatsink Power and Signal Specifications

Boxed Processor Fan

Heatsink Set Point (ºC)

Boxed Processor Fan Speed

Notes

When the internal chassis temperature is below or equal to this set point,

the fan operates at its lowest speed. Recommended maximum internal

chassis temperature for nominal operating environment.

X ≤ 30

When the internal chassis temperature is at this point, the fan operates

between its lowest and highest speeds. Recommended maximum

internal chassis temperature for worst-case operating environment.

Y = 34

When the internal chassis temperature is above or equal to this set point,

the fan operates at its highest speed.

Z ≥ 38

NOTES:

Set point variance is approximately ± 1 °C from fan heatsink to fan heatsink.

If the boxed processor fan heatsink 4-pin connector is connected to a 4-pin motherboard header and

the motherboard is designed with a fan speed controller with PWM output (CONTROL see

Table 7-1) and remote thermal diode measurement capability the boxed processor will operate as

follows:

As processor power has increased the required thermal solutions have generated increasingly more

noise. Intel has added an option to the boxed processor that allows system integrators to have a

quieter system in the most common usage.

The 4th wire PWM solution provides better control over chassis acoustics. This is achieved by

more accurate measurement of processor die temperature through the processor's temperature

diode (T

). Fan RPM is modulated through the use of an ASIC located on the motherboard that

diode

sends out a PWM control signal to the 4th pin of the connector labeled as CONTROL. The fan

speed is based on actual processor temperature instead of internal ambient chassis temperatures.

If the new 4-pin active fan heat sink solution is connected to an older 3-pin baseboard processor fan

header, it will default back to a thermistor controlled mode, allowing compatibility with existing 3-

pin baseboard designs. Under thermistor controlled mode, the fan RPM is automatically varied

based on the Tinlet temperature measured by a thermistor located at the fan inlet.

For more details on specific motherboard requirements for 4-wire based fan speed control see the

Intel Pentium 4 Processor on 90 nm Process in the 775-Land Package Thermal Design Guide.

Datasheet

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