MC74VHC245
OUTLINE DIMENSIONS
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 967–01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
L
E
20
11
Q
1
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
H
E
E
M
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
L
1
10
DETAIL P
Z
D
VIEW P
MILLIMETERS
INCHES
e
A
DIM
A
1
b
c
D
E
e
MIN
–––
MAX
2.05
0.20
0.50
0.27
12.80
5.45
MIN
MAX
0.081
0.008
0.020
0.011
0.504
0.215
c
–––
0.002
0.014
0.007
0.486
0.201
A
0.05
0.35
0.18
12.35
5.10
A
b
1
1.27 BSC
0.050 BSC
M
0.10 (0.004)
0.13 (0.005)
H
7.40
0.50
1.10
0
8.20
0.85
1.50
10
0.291
0.020
0.043
0
0.323
0.033
0.059
10
E
L
L
M
E
Q
Z
0.70
–––
0.90
0.81
0.028
–––
0.035
0.032
1
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MC74VHC245/D
◊
VHC Data – Advanced CMOS Logic
DL203 — Rev 1
7
MOTOROLA