Si541 Data Sheet
Electrical Specifications
Table 2.4. Environmental Compliance and Package Information
Parameter
Test Condition
Mechanical Shock
Mechanical Vibration
Solderability
MIL-STD-883, Method 2002
MIL-STD-883, Method 2007
MIL-STD-883, Method 2003
MIL-STD-883, Method 1014
MIL-STD-883, Method 2036
1
Gross and Fine Leak
Resistance to Solder Heat
Moisture Sensitivity Level (MSL): 3.2x5, 5x7 packages
Moisture Sensitivity Level (MSL): 2.5x3.2 package
2
Contact Pads
Gold over Nickel
Note:
1. For additional product information not listed in the data sheet (e.g. RoHS Certifications, MDDS data, qualification data, REACH
Declarations, ECCN codes, etc.), refer to our "Corporate Request For Information" portal found here: www.silabs.com/support/
quality/Pages/RoHSInformation.aspx.
Table 2.5. Thermal Conditions
Max Junction Temperature = 125° C
Package
Parameter
Symbol
ΘJA
Test Condition
Still Air, 85 °C
Still Air, 85 °C
Still Air, 85 °C
Still Air, 85 °C
Still Air, 85 °C
Still Air, 85 °C
Still Air, 85 °C
Still Air, 85 °C
Still Air, 85 °C
Value
80
Unit
ºC/W
ºC/W
ºC/W
ºC/W
ºC/W
ºC/W
ºC/W
ºC/W
ºC/W
Thermal Resistance Junction to Ambient
Thermal Parameter Junction to Board
Thermal Parameter Junction to Top Center
Thermal Resistance Junction to Ambient
Thermal Parameter Junction to Board
Thermal Parameter Junction to Top Center
Thermal Resistance Junction to Ambient
Thermal Parameter Junction to Board
Thermal Parameter Junction to Top Center
2.5 x 3.2 mm
6-pin DFN
ΨJB
ΨJT
39
17
ΘJA
55
3.2 × 5 mm
6-pin CLCC
ΨJB
ΨJT
20
20
ΘJA
53
5 × 7 mm
6-pin CLCC
ΨJB
ΨJT
26
26
Note:
1. Based on PCB Dimensions: 4.5" x 7", PCB Thickness: 1.6 mm, Number of Cu Layers: 4.
Table 2.6. Absolute Maximum Ratings1
Parameter
Maximum Operating Temp.
Symbol
TAMAX
TS
Rating
95
Unit
ºC
ºC
ºC
V
Storage Temperature
Supply Voltage
–55 to 125
–0.5 to 3.8
–0.5 to VDD + 0.3
2.0
VDD
Input Voltage
VIN
ESD HBM (JESD22-A114)
HBM
kV
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