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541FAB001023BBGR PDF预览

541FAB001023BBGR

更新时间: 2024-02-26 08:26:55
品牌 Logo 应用领域
芯科 - SILICON 振荡器
页数 文件大小 规格书
20页 634K
描述
CMOS Output Clock Oscillator,

541FAB001023BBGR 技术参数

生命周期:ActiveReach Compliance Code:unknown
风险等级:5.84振荡器类型:CMOS

541FAB001023BBGR 数据手册

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Si541 Data Sheet  
Electrical Specifications  
Table 2.4. Environmental Compliance and Package Information  
Parameter  
Test Condition  
Mechanical Shock  
Mechanical Vibration  
Solderability  
MIL-STD-883, Method 2002  
MIL-STD-883, Method 2007  
MIL-STD-883, Method 2003  
MIL-STD-883, Method 1014  
MIL-STD-883, Method 2036  
1
Gross and Fine Leak  
Resistance to Solder Heat  
Moisture Sensitivity Level (MSL): 3.2x5, 5x7 packages  
Moisture Sensitivity Level (MSL): 2.5x3.2 package  
2
Contact Pads  
Gold over Nickel  
Note:  
1. For additional product information not listed in the data sheet (e.g. RoHS Certifications, MDDS data, qualification data, REACH  
Declarations, ECCN codes, etc.), refer to our "Corporate Request For Information" portal found here: www.silabs.com/support/  
quality/Pages/RoHSInformation.aspx.  
Table 2.5. Thermal Conditions  
Max Junction Temperature = 125° C  
Package  
Parameter  
Symbol  
ΘJA  
Test Condition  
Still Air, 85 °C  
Still Air, 85 °C  
Still Air, 85 °C  
Still Air, 85 °C  
Still Air, 85 °C  
Still Air, 85 °C  
Still Air, 85 °C  
Still Air, 85 °C  
Still Air, 85 °C  
Value  
80  
Unit  
ºC/W  
ºC/W  
ºC/W  
ºC/W  
ºC/W  
ºC/W  
ºC/W  
ºC/W  
ºC/W  
Thermal Resistance Junction to Ambient  
Thermal Parameter Junction to Board  
Thermal Parameter Junction to Top Center  
Thermal Resistance Junction to Ambient  
Thermal Parameter Junction to Board  
Thermal Parameter Junction to Top Center  
Thermal Resistance Junction to Ambient  
Thermal Parameter Junction to Board  
Thermal Parameter Junction to Top Center  
2.5 x 3.2 mm  
6-pin DFN  
ΨJB  
ΨJT  
39  
17  
ΘJA  
55  
3.2 × 5 mm  
6-pin CLCC  
ΨJB  
ΨJT  
20  
20  
ΘJA  
53  
5 × 7 mm  
6-pin CLCC  
ΨJB  
ΨJT  
26  
26  
Note:  
1. Based on PCB Dimensions: 4.5" x 7", PCB Thickness: 1.6 mm, Number of Cu Layers: 4.  
Table 2.6. Absolute Maximum Ratings1  
Parameter  
Maximum Operating Temp.  
Symbol  
TAMAX  
TS  
Rating  
95  
Unit  
ºC  
ºC  
ºC  
V
Storage Temperature  
Supply Voltage  
–55 to 125  
–0.5 to 3.8  
–0.5 to VDD + 0.3  
2.0  
VDD  
Input Voltage  
VIN  
ESD HBM (JESD22-A114)  
HBM  
kV  
silabs.com | Building a more connected world.  
Rev. 1.1 | 6  

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