Datasheet > 541EAB000346BBGR

541EAB000346BBGR

更新时间： 2023-06-15 00:00:00

品牌	Logo	应用领域
芯科 - SILICON		/
页数	文件大小	规格书
20页	634K
描述
HCSL Output Clock Oscillator,

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541EAB000346BBGR 数据手册

Si541 Data Sheet

Electrical Specifications

Table 2.4. Environmental Compliance and Package Information

Parameter

Test Condition

Mechanical Shock

Mechanical Vibration

Solderability

MIL-STD-883, Method 2002

MIL-STD-883, Method 2007

MIL-STD-883, Method 2003

MIL-STD-883, Method 1014

MIL-STD-883, Method 2036

Gross and Fine Leak

Resistance to Solder Heat

Moisture Sensitivity Level (MSL): 3.2x5, 5x7 packages

Moisture Sensitivity Level (MSL): 2.5x3.2 package

Contact Pads

Gold over Nickel

Note:

1. For additional product information not listed in the data sheet (e.g. RoHS Certifications, MDDS data, qualification data, REACH

Declarations, ECCN codes, etc.), refer to our "Corporate Request For Information" portal found here: www.silabs.com/support/

quality/Pages/RoHSInformation.aspx.

Table 2.5. Thermal Conditions

Max Junction Temperature = 125° C

Package

Parameter

Symbol

Θ_JA

Test Condition

Still Air, 85 °C

Value

Unit

ºC/W

Thermal Resistance Junction to Ambient

Thermal Parameter Junction to Board

Thermal Parameter Junction to Top Center

Thermal Resistance Junction to Ambient

Thermal Parameter Junction to Board

Thermal Parameter Junction to Top Center

Thermal Resistance Junction to Ambient

Thermal Parameter Junction to Board

Thermal Parameter Junction to Top Center

2.5 x 3.2 mm

6-pin DFN

Ψ_JB

Ψ_JT

Θ_JA

3.2 × 5 mm

6-pin CLCC

Ψ_JB

Ψ_JT

Θ_JA

5 × 7 mm

6-pin CLCC

Ψ_JB

Ψ_JT

Note:

1. Based on PCB Dimensions: 4.5" x 7", PCB Thickness: 1.6 mm, Number of Cu Layers: 4.

Table 2.6. Absolute Maximum Ratings¹

Parameter

Maximum Operating Temp.

Symbol

T_AMAX

T_S

Rating

Unit

ºC

Storage Temperature

Supply Voltage

–55 to 125

–0.5 to 3.8

–0.5 to V_DD+ 0.3

2.0

V_DD

Input Voltage

V_IN

ESD HBM (JESD22-A114)

HBM

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Rev. 1.1 | 6

1...3 4 567 8 9...20

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