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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 53398-0890 | MOLEX |
获取价格 |
1.24 WIRE To BOARD CONN. WAFER ASSY FOR SMT |
|
| 53398-0910 | MOLEX |
获取价格 |
1.24 WIRE To BOARD CONN. WAFER ASSY FOR SMT |
|
| 53398-0919 | MOLEX |
获取价格 |
Board Connector, 9 Contact(s), 1 Row(s), Male, Straight, 0.049 inch Pitch, Surface Mount T |
|
| 53398-0943 | MOLEX |
获取价格 |
Board Connector, 9 Contact(s), 1 Row(s), Male, Straight, 0.049 inch Pitch, Surface Mount T |
|
| 53398-0954 | MOLEX |
获取价格 |
Board Connector, 9 Contact(s), 1 Row(s), Male, Straight, 0.049 inch Pitch, Surface Mount T |
|
| 53398-0956 | MOLEX |
获取价格 |
Board Connector, 9 Contact(s), 1 Row(s), Male, Straight, 0.049 inch Pitch, Surface Mount T |
|
| 53398-0971 | MOLEX |
获取价格 |
1.25mm (.049") Pitch PicoBlade™ Header, Surfa |
|
| 53398-0976 | MOLEX |
获取价格 |
Board Connector, 9 Contact(s), 1 Row(s), Male, Straight, 0.049 inch Pitch, Surface Mount T |
|
| 53398-0977 | MOLEX |
获取价格 |
Board Connector, 9 Contact(s), 1 Row(s), Male, Straight, 0.049 inch Pitch, Surface Mount T |
|
| 53398-0990 | MOLEX |
获取价格 |
1.24 WIRE To BOARD CONN. WAFER ASSY FOR SMT |
|
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意法半导体发布第四代SiC技术，助力电动汽车电驱
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