1801 Morgan Street
Rockford, Illinois 61102
800-435-2931
www.molexkits.com
Datasheet for 76650-0192
General Information
Part Number:
76650-0192
Manufacturer:
Title:
Molex / Waldom
Deluxe Board Stacking Application Kit
Includes KK100, HDM, EBBI 50D, SEARAY, Plateau HS Mezz, IEEE1386,
SlimStack Product Families. Pitches range: 0.635mm (.025)" - 2.54mm (0.1)"
Mezzanine IEEE 1386, HDM®**, SlimStack™, KK® 100, EBBI™ 50D, Plateau HS
Mezz™, and SEARAY*
Description:
Product Family:
Certificates:
(Molex Parts within this kit) - EU RoHS and RoHS by Exempt Compliant
Country of Origin: Kit assembled in U.S.A.
Specifications
Design
Configuration:
Board-to-Board
0.635mm (.025"), 1.0mm (.039"), 1.20mm (.047"), 1.27mm (.050"), [1.27mm
(.050")]sq. , 2mm (.079"), and 2.54mm (.100")
Pitch:
Connector Type:
Circuit Sizes:
Current Rating:
Voltage:
Receptacles and Headers/Plugs
2, 3, 4, 6, 8, 12, 20, 50, 64, 72 and 200
0.5, 1.0, 1.5, 2.5 and 4 Amps
30, 100 and 240 Volts
Product Highlights
The SEARAY board-to-board connector is designed for computer, networking,
telecom, storage and general market applications with high pin-count devices or
memory modules that are mounted on mezzanine or module PC Boards (PCBs).
The design of our SEARAY has superior electrical and mechanical features that are
cost competitive. The unique, Molex-patented, solder charge technology results in
better process yields and a lower applied cost versus equivalent BGA connector
products. Circuit sizes range from 160 through 500 positions, and mated stack
heights cover 7mm (.276") to 13mm (.512").
Molex's SlimStack connectors are tested to accommodate frequency rates up to 3
GHz for various high-speed applications. With a broad range of circuit sizes and
stack heights, SlimStack offers an economical way to achieve high-speed
performance in both 50 and 100 Ohm systems.
Utilizes proprietary Plateau Technology™ (plated gold housing) to provide a high-
speed high-density mezzanine connector system for differential and single-ended
signal applications. The gold-plated plastic shields each differential pair from neigh-
boring pairs, lowering crosstalk and improving signal clarity. Different stack heights
and circuit sizes provide flexibility in design and grounding the conductive housing
eliminates the need for individual ground pin designations within the connector.
* SEARAY is a trademark of Samtec, Inc.
** HDM® is a registered trademark of Amphenol Corporation
For additional Molex / Waldom Design and Solution Kits please go to www.molexkits.com
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