5秒后页面跳转
| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 52559-2452 | MOLEX |
获取价格 |
0.50mm (.020") Pitch FFC/FPC Connector, Vertical, SMT, ZIF, 24 Circuits, Lead-freeGold Con |
|
| 52559-2472 | MOLEX |
获取价格 |
0.5 FPC CONN ASSY ZIF SMT ST EMBSTP PKG |
|
| 52559-2492 | MOLEX |
获取价格 |
0.5 FPC CONN ASSY ZIF SMT ST EMBSTP PKG |
|
| 52559-2517 | MOLEX |
获取价格 |
Card Edge Connector, 25 Contact(s), 1 Row(s), Female, Straight, 0.02 inch Pitch, Surface M |
|
| 52559-2534 | MOLEX |
获取价格 |
Card Edge Connector, 25 Contact(s), 1 Row(s), Straight, 0.02 inch Pitch, Surface Mount Ter |
|
| 52559-2570 | MOLEX |
获取价格 |
Card Edge Connector, 25 Contact(s), 1 Row(s), Female, Straight, 0.02 inch Pitch, Surface M |
|
| 52559-2617 | MOLEX |
获取价格 |
Card Edge Connector, 26 Contact(s), 1 Row(s), Female, Straight, 0.02 inch Pitch, Surface M |
|
| 52559-2619 | MOLEX |
获取价格 |
Card Edge Connector, 26 Contact(s), 1 Row(s), Female, Straight, 0.02 inch Pitch, Surface M |
|
| 52559-2633 | MOLEX |
获取价格 |
Card Edge Connector, 26 Contact(s), 1 Row(s), Straight, 0.02 inch Pitch, Surface Mount Ter |
|
| 52559-2652 | MOLEX |
获取价格 |
0.50mm (.020") Pitch FFC/FPC Connector, Vertical, SMT, ZIF, 26 Circuits, Lead-free,Gold Co |
|
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
工作时间：9:00-21:00
CEO邮箱：ceo@jiepei.com
投诉邮箱：tousu@jiepei.com
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
