Datasheet > 513AL-01

513AL-01

更新时间： 2024-09-16 07:55:27

品牌	Logo	应用领域
安森美 - ONSEMI		电子
页数	文件大小	规格书
2页	67K
描述
Electronic versions are uncontrolled except when accessed directly

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数据手册

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513AL-01 数据手册

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

TLLGA140 10x10, 0.5P, Dual−Row, Staggered−Pad

CASE 513AL−01

ISSUE O

DATE 20 OCT 2009

SCALE 1:1

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

140X

2. CONTROLLING DIMENSION: MILLIMETERS

3. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

A39

B33

PIN ONE

LOCATION

e/2

MILLIMETERS

DIM MIN

MAX

0.60

0.05

0.35

0.50

---

0.25

10.00 BSC

5.70

5.90

10.00 BSC

5.70

140X b

0.15

0.50 BSC

DETAIL A

0.25

0.35

0.15

GENERIC MARKING

DIAGRAM

TOP VIEW

0.10

0.08

XXXXXXXXX

AWLYYWWG

NOTE 3

SEATING

PLANE

SIDE VIEW

XXXXX = Device Code

0.15 C A

= Assembly Site

= Wafer Lot

= Year

= Work Week

= Pb−Free Package

140X

A39

A20

B17

B33

DETAIL A

0.15

e/2

RECOMMENDED

SOLDERING FOOTPRINT*

0.10

140X

5.95

100X

0.35

A B

40X

0.48

0.50

PITCH

0.05

B49

A58

A76

B64

100X

0.35

BOTTOM VIEW

10.10

5.95

40X

0.48

0.50

PITCH

0.25

10.10

DIMENSION: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

98AON42332E

DOCUMENT NUMBER:

Electronic versions are uncontrolled except when

accessed directly from the Document Repository. Printed

_{© Semiconductor Components Industries}O_{, LL}N_C,S₂₀E₀₂MICONDUCTOR STANDARD

STATUS:

Case Outline Number:

versions are uncontrolled except when stamped

October, 2002 − Rev. 01O

485M

“CONTROLLED COPY” in red.

NEW STANDARD:

Case Outline Number:

http://onsemi.com

October, 2002 − Rev. 0

DESCRIPTION: TLLGA140, 10X10, 0.5P

PAGE 1 OFX2XX

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