Datasheet > 512NBA000874AAGR

512NBA000874AAGR

更新时间： 2024-01-25 11:27:26

品牌	Logo	应用领域
芯科 - SILICON		振荡器
页数	文件大小	规格书
23页	603K
描述
CMOS Output Clock Oscillator,

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512NBA000874AAGR 技术参数

Si512/513

2. Solder Reflow and Rework Requirements for 2.5x3.2 mm Packages

Reflow of Silicon Labs' components should be done in a manner consistent with the IPC/JEDEC J-STD-20E

standard. The temperature of the package is not to exceed the classification Temperature provided in the standard.

The part should not be within -5°C of the classification or peak reflow temperature (T

) for longer than 30

PEAK

seconds. Key to maintaining the integrity of the component is providing uniform heating and cooling of the part

during reflow and rework. Uniform heating is achieved through having a preheat soak and controlling the

temperature ramps in the process. J-STD-20E provides minimum and maximum temperatures and times for the

preheat/Soak step that need to be followed, even for rework. The entire assembly area should be heated during

rework. Hot air should be flowed from both the bottom of the board and the top of the component. Heating from the

top only will cause un-even heating of component and can lead to part integrity issues. Temperature Ramp-up rate

are not to exceed 3°C/second. Temperature ramp-down rates from peak to final temperature are not to exceed

6°C/second. Time from 25°C to peak temperature is not to exceed 8 min for Pb-free solders.

Rev. 1.2

1...7 8 91011 12 13...23

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