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5.0SMLJ110A-T PDF预览

5.0SMLJ110A-T

更新时间: 2024-01-07 08:36:14
品牌 Logo 应用领域
美微科 - MCC /
页数 文件大小 规格书
4页 130K
描述
Transient Suppressor,

5.0SMLJ110A-T 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.10.00.50风险等级:5.73
JESD-609代码:e0湿度敏感等级:1
端子面层:Tin/Lead (Sn/Pb)Base Number Matches:1

5.0SMLJ110A-T 数据手册

 浏览型号5.0SMLJ110A-T的Datasheet PDF文件第2页浏览型号5.0SMLJ110A-T的Datasheet PDF文件第3页浏览型号5.0SMLJ110A-T的Datasheet PDF文件第4页 
5.0SMLJ11A  
THRU  
5.0SMLJ170A  
M C C  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TM  
Micro Commercial Components  
Features  
Transient  
Voltage Suppressor  
11 to 170 Volts  
5000 Watt  
For surface mount application in order to optimize board space  
Low profile package  
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates  
Compliant. See ordering information)  
Glass passivated junction  
Excellent clamping capability  
Repetition Rate( duty cycle): 0.01%  
DO-214AB  
(SMCJ) (LEAD FRAME)  
Fast response time: typical less than 1ps from 0V to BV min  
Typical ID less than 1uA above 10V  
High temperature soldering: 260oC/10 seconds at terminals  
G
Low Inductance  
Built in strain relief  
H
UL Recognized File # E331408  
D
Mechanical Data  
A
C
Case Material: Molded Plastic. UL Flammability  
Classification Rating 94V-0 and MSL rating 1  
E
B
Terminals: solderable per MIL-STD-750, Method 2026  
Polarity: Color band denotes positive end( cathode) except  
Bi-directional types.  
F
DIMENSIONS  
INCHES  
MIN  
.079  
.115  
.002  
.006  
.030  
..305  
.260  
.220  
MM  
MIN  
2.00  
2.92  
0.051  
0.152  
0.76  
7.75  
6.60  
DIM  
A
B
C
D
E
F
G
H
MAX  
.103  
.121  
.008  
.012  
.050  
.320  
MAX  
2.62  
NOTE  
3.07  
Standard packaging: 16mm tape per ( EIA 481).  
Weight: 0.007 ounce, 0.21 gram  
0.203  
0.305  
1.27  
8.13  
7.11  
6.22  
.280  
.245  
Maximum Ratings @ 25oC Unless Otherwise Specified  
5.59  
Peak Pulse Current on  
10/1000us  
IPPM See page 2,3 Amps  
SUGGESTED SOLDER  
PAD LAYOUT  
waveform(Note1)  
Peak Pulse Power  
Disspation on 10/1000us  
waveform(Note2,3)  
Peak forward surge  
current (JEDEC  
0.280"  
PPPM Minimum Watts  
5000  
IFSM)  
300.0  
Amps  
0.121”  
Method) (Note 3,4)  
Operation And Storage  
Temperature Range  
TJ,  
TSTG  
-55oC to  
+150oC  
0.060”  
Note: 1.  
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.  
2.  
3.  
4.  
Non-repetitive current pulse and derated above TA=25oC  
Mounted on 8.0mm2 copper pads to each terminal.  
8.3ms, single half sine-wave or equivalent square wave, duty cycle=4 pulses per. Minutes maximum.  
www.mccsemi.com  
Revision: 4  
2009/07/12  
1 of 4  

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