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5.0SMLJ11A-TP PDF预览

5.0SMLJ11A-TP

更新时间: 2024-02-24 04:37:08
品牌 Logo 应用领域
美微科 - MCC /
页数 文件大小 规格书
5页 337K
描述
Trans Voltage Suppressor Diode, 5000W, 11V V(RWM), Unidirectional, 1 Element, Silicon, DO-214AB, SMCJ, 2 PIN

5.0SMLJ11A-TP 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:R-PDSO-C2Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.53其他特性:EXCELLENT CLAMPING CAPABILITY, PRSM-MIN
最大击穿电压:13.5 V最小击穿电压:12.2 V
击穿电压标称值:12.85 V最大钳位电压:18.2 V
配置:SINGLE二极管元件材料:SILICON
二极管类型:TRANS VOLTAGE SUPPRESSOR DIODEJEDEC-95代码:DO-214AB
JESD-30 代码:R-PDSO-C2JESD-609代码:e3
湿度敏感等级:1最大非重复峰值反向功率耗散:5000 W
元件数量:1端子数量:2
最高工作温度:175 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性:BIDIRECTIONAL最大功率耗散:6.5 W
最大反向电流:800 µA反向测试电压:11 V
表面贴装:YES技术:AVALANCHE
端子面层:Tin (Sn)端子形式:C BEND
端子位置:DUAL处于峰值回流温度下的最长时间:10
Base Number Matches:1

5.0SMLJ11A-TP 数据手册

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5.0SMLJ11A  
THRU  
5.0SMLJ170CA  
M C C  
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20736 Marilla Street Chatsworth  
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ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TM  
Micro Commercial Components  
Features  
Transient  
Voltage Suppressor  
11 to 170 Volts  
5000 Watt  
Halogen free available upon request by adding suffix "-HF"  
For surface mount application in order to optimize board space  
Low profile package  
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates  
Compliant. See ordering information)  
Glass passivated junction  
Excellent clamping capability  
Repetition Rate( duty cycle): 0.01%  
DO-214AB  
(SMCJ) (LEAD FRAME)  
Fast response time: typical less than 1ps from 0V to BV min  
Typical ID less than 1uA above 10V  
High temperature soldering: 260oC/10 seconds at terminals  
G
Low Inductance  
Built in strain relief  
H
UL Recognized File # E331408  
D
Mechanical Data  
A
C
·
·
Epoxy meets UL 94 V-0 flammability rating  
Moisture Sensitivity Level 1  
E
B
Terminals: solderable per MIL-STD-750, Method 2026  
Polarity: Color band denotes positive end( cathode) except  
Bi-directional types.  
F
DIMENSIONS  
INCHES  
MIN  
.079  
.115  
.002  
.006  
.030  
..305  
.260  
.220  
MM  
MIN  
2.00  
2.92  
0.051  
0.152  
0.76  
7.75  
6.60  
DIM  
A
B
C
D
E
F
G
H
MAX  
.103  
.121  
.008  
.012  
.050  
.320  
MAX  
2.62  
NOTE  
3.07  
Standard packaging: 16mm tape per ( EIA 481).  
Weight: 0.007 ounce, 0.21 gram  
0.203  
0.305  
1.27  
8.13  
7.11  
6.22  
.280  
.245  
Maximum Ratings @ 25oC Unless Otherwise Specified  
5.59  
Peak Pulse Current on  
10/1000us waveform(Note2)  
IPPM See page 2,3 Amps  
SUGGESTED SOLDER  
PAD LAYOUT  
Peak Pulse Power  
Disspation on 10/1000us  
waveform(Note2,3)  
PPPM Minimum Watts  
5000  
0.190"  
Power Dissipation on infinite PD  
6.5  
Watts  
Amps  
heat sink at TL=75oC  
0.125”  
Peak forward surge  
IFSM)  
300.0  
current (JEDEC  
Method) (Note 3,4)  
Operation And Storage  
Temperature Range  
0.070”  
TJ,  
TSTG  
-55oC to  
+175oC  
Note:  
1.  
2.  
3.  
4.  
High Temperature Solder Exemptions Applied,see EU Directive Annex 7.  
Non-repetitive current pulse and derated above TA=25oC  
Mounted on 8.0mm2 copper pads to each terminal.  
8.3ms, single half sine-wave or equivalent square wave, duty cycle=4 pulses per. Minutes maximum.  
www.mccsemi.com  
Revision: F  
2013/01/01  
1 of 5  

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