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| 5-794632-2 | TE |
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| 5-794632-2 | MACOM |
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VERTICAL HEADER ASSEMBLY, THRU HOLE, 30 GOLD, DUAL ROW, MICRO MATE-N-LOK |
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| 5-794632-4 | TE |
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| 5-794632-4 | MACOM |
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VERTICAL HEADER ASSEMBLY, THRU HOLE, 30 GOLD, DUAL ROW, MICRO MATE-N-LOK |
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| 5-794633-0 | TE |
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| 5-794633-2 | TE |
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THIS DRAWING IS A CONTROLLED DOCUMENT. |
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| 5-794633-4 | TE |
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| 5-794634-0 | TE |
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THIS DRAWING IS A CONTROLLED DOCUMENT. |
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| 5-794634-2 | TE |
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THIS DRAWING IS A CONTROLLED DOCUMENT. |
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| 5-794634-4 | TE |
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THIS DRAWING IS A CONTROLLED DOCUMENT. |
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解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
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