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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 5-569552-4 | MACOM |
获取价格 |
MODULAR PLUG ASSEMBLY, 8 POSITION, SHIELDED, ROUND CABLE, STRANDED WIRE, HIGH PERFORMANCE |
|
| 5569564-1 | MACOM |
获取价格 |
MODULAR JACK ASSEMBLY, 8 POSITION, RIGHT ANGLE, LOW PROFILE, PANEL GROUND WITH LEDS |
|
| 5569564-4 | MACOM |
获取价格 |
MODULAR JACK ASSEMBLY, 8 POSITION, RIGHT ANGLE, LOW PROFILE, PANEL GROUND WITH LEDS |
|
| 5569564-5 | MACOM |
获取价格 |
MODULAR JACK ASSEMBLY, 8 POSITION, RIGHT ANGLE, LOW PROFILE, PANEL GROUND WITH LEDS |
|
| 5569984-2 | ETC |
获取价格 |
Quick Reference Guide |
|
| 5569MTH1R | ETC |
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THE WIDEST RANGE IN MINIATURE SWITCHES |
|
| 556A4U | ETC |
获取价格 |
Infrared Emitting Diodes (UL Listed) |
|
| 556DCB700K2R | ILLINOISCAPACITOR |
获取价格 |
Metallized Polypropylene Film Capacitors |
|
| 556DCB700K2R | CDE |
获取价格 |
5.7 mΩ |
|
| 556DCB700K4R | ILLINOISCAPACITOR |
获取价格 |
Radial Leaded Metallized Polypropylene Film Capacitors |
|
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
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