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4816P-T01-101 PDF预览

4816P-T01-101

更新时间： 2024-01-22 20:33:09
品牌 Logo 应用领域
其他 - ETC /
页数 文件大小 规格书
62页 1877K
描述
WIDERSTAND NETZWERK DICKFILM 100R 5ST

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中文翻译

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4816P-T01-101 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：SO-16
Reach Compliance Code：not_compliant风险等级：5.29
构造：Chip元件功耗：0.16 W
第一元件电阻：100 ΩJESD-609代码：e2
引线间距：1.27 mm安装特点：SURFACE MOUNT
网络类型：ISOLATED元件数量：1
功能数量：8端子数量：16
最高工作温度：125 °C最低工作温度：-55 °C
封装高度：2.03 mm封装长度：11.18 mm
封装形状：RECTANGULAR PACKAGE封装形式：SMT
封装宽度：5.59 mm包装方法：TUBE
额定功率耗散 (P)：1.28 W额定温度：70 °C
参考标准：AEC-Q200电阻：100 Ω
电阻器类型：ARRAY/NETWORK RESISTOR尺寸代码：2244
子类别：ARRAY/NETWORK RESISTOR表面贴装：YES
技术：METAL GLAZE/THICK FILM温度系数：100 ppm/ °C
温度系数跟踪：50 ppm/ °C端子面层：Tin/Copper (Sn/Cu)
端子形状：GULL WING容差：1%
工作电压：50 V

4816P-T01-101 数据手册

 浏览型号4816P-T01-101的Datasheet PDF文件第56页浏览型号4816P-T01-101的Datasheet PDF文件第57页浏览型号4816P-T01-101的Datasheet PDF文件第58页浏览型号4816P-T01-101的Datasheet PDF文件第59页浏览型号4816P-T01-101的Datasheet PDF文件第60页浏览型号4816P-T01-101的Datasheet PDF文件第62页 
Soldering/Cleaning Methods  
FLOW  
REFLOW  
Hot Air,  
Infrared  
(Solvent)  
X
Vapor Phase  
Wave  
Wave  
Process Step  
(Solvent)  
X
(Solvent)  
(Aqueous)  
Material  
RMA  
1. Solder Paste Printing  
2. Adhesive Application  
3. Switch Placement  
4. Adhesive Cure  
X
X
X
X
X
X
X
Epoxy  
X
X
These are the common  
methods, materials and  
maximum temperature/  
time parameters for  
soldering and cleaning  
processes:  
5. Flux Application  
5. Flux Application  
6. Solder (Reflow)  
7. Solder (Flow)  
Rosin  
X
X
Organic Acid  
63/37 Sn/Pb  
63/37 Sn/Pb  
ODS Free  
X
X
X
X
X
X
8. Wash (Solvent)  
9. Wash (Aqueous)  
High Pressure Fluids  
Ultrasonics  
X
X
DI H2O; Detergent  
X
X
X
Max. Temp.(°C)/Time (Seconds)  
240/30  
215/180  
260/5  
260/5  
6 7 8 9  
Solder  
Solder  
Wash  
Wash  
Reflow; Convection,  
IR and Vapor Phase  
Flow (Wave)  
Solvent  
Aqueous  
GENERAL  
GENERAL  
GENERAL  
GENERAL  
Preheat sufficiently using both time  
and temp. to bring the flux to activa-  
tion and minimize thermal shock.  
Consult your solder paste supplier for  
the recommended profile.  
For maximum component reliability  
and performance, minimize the time  
of temp. exposure above 200°C.  
Use solvent cleaning primarily  
for nonpolar contaminants  
such as rosin based flux  
residues.  
Use aqueous cleaning primarily  
for polar contaminants such as  
organic flux residues.  
RECOMMENDED  
Typical alloy is Sn63/Pb37. A typical  
wave solder zone profile is 245˚C for  
5 sec.  
RECOMMENDED  
RECOMMENDED  
Use any suitable washing sol-  
vents that meet ODS require-  
ments.  
Use De-ionized or Reverse  
Osmosis water with multistage  
rinsing. Post bake at 100˚C for  
30 minutes to remove any resid-  
ual moisture.  
RECOMMENDED  
Typical IR/Convection profile.  
PRE-HEATING SOLDERING GRADUAL COOLING  
PRE-HEATING SOLDERING GRADUAL COOLING  
CAUTION  
Limit excessive direct spray  
pressure to 60 psi.  
(in air)  
(in air)  
(in air)  
(in air)  
CAUTION  
Limit excessive direct spray  
245°C  
200°C  
200°C  
230°C  
pressure to 60 psi.  
100°C  
0°C  
100°C  
0°C  
Allow the assembly to suffi-  
ciently cool prior to the wash-  
ing operation for minimized  
thermal stress.  
ONE MINUTE  
MIN.  
Allow the assembly to sufficient-  
ly cool prior to the washing oper-  
ation for minimized thermal  
stress.  
5 SECOND  
MAX.  
ONE MINUTE  
MIN.  
20 SECOND  
MAX.  
Use convection or Vapor Phase when  
possible and minimize the time above  
reflow temperature.  
CAUTION  
Always preheat before the soldier  
wave using the temperature for flux  
activation recommended by the man-  
ufacturer.  
CAUTION  
Do not exceed time and temperature  
reflow profile of 240°C for 30 sec. for  
Hot Air/IR reflow and 215°C for 3  
minutes for vapor phase reflow.  
Board Rework Technique  
Do not exceed 240˚C peak tempera-  
ture for dual wave solder process  
with a flow zone totaling 5 seconds.  
RECOMMENDED  
Hot air reflow technique is pre-  
ferred. Use No Clean or Rosin  
based fluxes only, OA fluxes are  
recommended.  
Minimize thermal shock by limiting  
temperature ramps to 3°C/sec. and by  
stabilizing board and component tem-  
perature during preheating.  
Minimize thermal shock by limiting  
temperature ramps to 3˚C/sec. and by  
stabilizing board and component  
temperature during preheating.  
GENERAL  
CAUTION  
Excessive and/or repeated high  
temperature exposure may  
affect the component perfor-  
mance and reliability.  
Avoid the use of wave soldering  
or soldering irons as a rework  
technique. Avoid repeated and  
excessive temperature exposure.  
Specifications are subject to change without notice.  
337  
1...5859606162

中文翻译

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4816P-T01-103 BOURNS Array/Network Resistor, Isolated, Metal Glaze/thick Film, 1.28W, 10000ohm, 50V, 2% +/-Tol,

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4816P-T01-103F BOURNS Array/Network Resistor, Isolated, Metal Glaze/thick Film, 1.28W, 10000ohm, 50V, 1% +/-Tol,

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