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4280-0-65-80-16-80-10-0 PDF预览

4280-0-65-80-16-80-10-0

更新时间: 2024-11-15 03:41:55
品牌 Logo 应用领域
仕元机械 - MILL-MAX PC
页数 文件大小 规格书
2页 227K
描述
PCB Terminal, ROHS COMPLIANT

4280-0-65-80-16-80-10-0 数据手册

 浏览型号4280-0-65-80-16-80-10-0的Datasheet PDF文件第2页 
solutions  
MAXIMUM  
Receptacles on Tape for Automated Assembly  
Mill-Max offers receptacles (discrete sockets) on carrier tape per EIA-481 to feed automated ‘pick &  
place’ assembly equipment. Our standard reel size has been 13”, but now for 8 & 12mm wide carrier tapes,  
we also offer the new 7” ‘mini’ reel. A 7” reel holds about one quarter the parts of a 13” reel. This is more  
economic and convenient for smaller volume customers who want the benefit of automated assembly.  
• Two types of receptacles are available on carrier tape: surface mount, flat types, which sit on the  
surface of the PCB where the pin or component lead plugs-in parallel to the PCB; and thru-hole types  
where the lead plugs-in perpendicular to the PCB. Thru-hole receptacles are intrusive reflow soldered*.  
Our increasingly popular thru-hole (tubular) receptacles have an Organic Fibre Plug® barrier which  
prevents solder, paste or flux from contaminating the spring contact. After soldering, the OFP®  
barrier is pushed out of the receptacle when the device is plugged in.  
• Also new for Mill-Max is the availability of RoHS “lead free” plating options. Instead of traditional  
tin/lead plating on the receptacle’s shell and contact, a pure matte tin with oxide and whisker inhibitors  
can be specified.  
*Intrusive reflow (also called "pin-in-paste") is a technique of using conventional thru-hole components in a reflow soldering  
process. The receptacles are placed into plated-thru-holes in the circuit board (solder paste has previously been screen printed  
on pads adjacent to the holes) and the board is reflowed in the same pass as other SMT components. Solder will fill the plated-  
thru-holes and achieve solder joints as reliable as wave soldering. The OFP® barrier prevents solder paste from being picked-  
up inside the contact during pick ‘n place assembly. "Overprinting" paste on the solder mask can be used to adjust the volume  
of paste required to fill each hole.  
(02/06-558)  
R
Mill-Max Mfg. Corp. • 190 Pine Hollow Road, Oyster Bay, NY 11771-0300  
516-922-6000 • Fax: 516-922-9253 • www.mill-max.com  
Maximum Interconnect Solutions  

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