Datasheet > 405I22D25M00000

405I22D25M00000

更新时间： 2024-02-06 08:44:39

品牌	Logo	应用领域
西迪斯 - CTS		驱动晶体谐振器
页数	文件大小	规格书
2页	173K
描述
Parallel - Fundamental Quartz Crystal, 25MHz Nom, GREEN, CERAMIC PACKAGE-4

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405I22D25M00000 技术参数

是否Rohs认证：	符合	生命周期：	Active
包装说明：	GREEN, CERAMIC PACKAGE-4	Reach Compliance Code：	compliant
HTS代码：	8541.60.00.60	Factory Lead Time：	8 weeks
风险等级：	5.33	其他特性：	AT-CUT; TAPE AND REEL
老化：	5 PPM/YEAR	晶体/谐振器类型：	PARALLEL - FUNDAMENTAL
驱动电平：	10 µW	频率稳定性：	0.002%
频率容差：	20 ppm	JESD-609代码：	e4
负载电容：	18 pF	安装特点：	SURFACE MOUNT
标称工作频率：	25 MHz	最高工作温度：	85 °C
最低工作温度：	-40 °C	物理尺寸：	L5.0XB3.2XH1.0 (mm)/L0.197XB0.126XH0.039 (inch)
串联电阻：	50 Ω	表面贴装：	YES
端子面层：	Gold (Au) - with Nickel (Ni) barrier	Base Number Matches：	1

405I22D25M00000 数据手册

Model 405

Quartz Crystal

ELECTRICAL CHARACTERISTICS

PARAMETER

Frequency Range

Operating Mode

VALUE

6.76438MHz to 54MHz

Fundamental

Crystal Cut

AT-Cut

Frequency Tolerance @ +25°C

Frequency Stability Tolerance

[Operating Temperature Range, Referenced to +25°C Reading]

±30ppm, Standard

-20°C to +70°C

Operating Temperature Ranges

-30°C to +85°C

-40°C to +85°C

80 Ohms

6.76438MHz - <11MHz

11MHz - <15MHz

15MHz - <35MHz

35MHz - 54MHz

60 Ohms

50 Ohms

40 Ohms

Equivalent Series Resistance [Maximum]

Load Capacitance

See Ordering Information

Shunt Capacitance [C₀]

5.0pF Typical, 7.0pF Maximum

Drive Level

Aging @ +25°C

10µW Typ., 200µW Max.

±3ppm/yr Typical

Insulation Resistance

Storage Temperature Range

500M Ohms @ DC 100V

-40°C to +100°C

MECHANICAL SPECIFICATIONS

PACKAGE DRAWING

MARKING INFORMATION

1. XX.XXX – Frequency marked with 3 significant digits after

the decimal.

2. C – CTS and Pin 1 identifier.

3. ** - Manufacturing Site Code.

4. YWW – Date Code; Y – Last Digit of Year, WW – Week.

XX.XXX

C**YWW

NOTES

1. Complete CTS part number, frequency value, date code and

manufacturing site code information must appear on reel

and carton labels.

2. Terminations #2, #4 and the metal lid are connected

internally. End user may connect these pins to circuit

ground for EMI suppression.

3. Termination pads (e4); barrier plating is nickel [Ni] with gold

[Au] flash plate.

4. Reflow conditions per JEDEC J-STD-020; +260°C maximum,

10 seconds.

5. MSL = 1.

SUGGESTED SOLDER PAD GEOMETRY

Document No. 008-0253-0

Page 2 - 2

Rev. H

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