Datasheet > 3SMAJ5913B_13

3SMAJ5913B_13

更新时间： 2024-09-24 12:33:39

品牌	Logo	应用领域
美微科 - MCC		稳压二极管
页数	文件大小	规格书
4页	338K
描述
3.0 Watt Surface Mount Silicon Zener Diodes Surface Mount Application

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3SMAJ5913B_13 数据手册

3SMAJ5913B

THRU

3SMAJ5956B

M C C

ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents

20736 Marilla Street Chatsworth

ꢆꢋꢅꢌꢍꢎꢍꢍ

ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ

$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ

Micro Commercial Components

Features

3.0 Watt

Surface Mount

Silicon

•

3.3thru 200 Volt Voltage Range

Low Inductance, Low Profile Mounting

Glasss Passivated Junction

High specified maximum current(IZM)when adequately heat sinking

Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates

Compliant. See ordering information)

•

Halogen free available upon request by adding suffix "-HF"

Surface Mount Application

Zener Diodes

ꢀ

Mechanical Data

DO-214AC

ꢀ

Epoxy meets UL 94 V-0 flammability rating

ꢀ

(SMA) (LEAD FRAME)

ꢀ

Moisture Sensitivity Level 1

ꢀ

Terminals solderable per MIL-STD-750, Method 2026

Polarity is indicated by cathode band.

ꢀ

Packaging: Standard 12mm Tape (see EIA 481)

Maximum temperature for soldering: 260⁰C for 10 seconds.

Maximum Ratings @ 25^oC Unless Otherwise Specified

Maximum

V_F

1.5V

(Note: 2)

(Note: 3)

Forward

Voltage

Steady State

P_d

3.0W

DIMENSIONS

Power

INCHES

MIN

.079

.050

.002

---

MIN

2.00

1.27

.05

Dissipation

DIM

MAX

2.44

1.63

.20

NOTE

Operation and

Storage

Temperature

T_J, T_STG-55^oC to

.096

.064

.008

.02

+150^oC

---

.51

.030

.065

.189

.157

.090

.060

.091

.220

.181

.115

.76

1.52

2.32

5.59

4.60

2.92

1.65

4.80

4.00

2.25

Thermal

25R/W

Resistance

R_thJL

SUGGESTED SOLDER

PAD LAYOUT

Junction to Lead

Thermal

0.090"

135R/W

Resistance

thJA

Junction to Ambient

0.085"

Note: 1.

High Temperature Solder Exemptions Applied, see EU Directive Annex 7.

Forward Current @ 200mA.

0.070"

Mounted on 5.0mm2 (1oz thick) Iand areas.

Lead temperature at T

L=75

A=15 C

www.mccsemi.com

Revision: D

2013/04/11

1 of 4

12 3 4

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