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3EZ39D5RL PDF预览

3EZ39D5RL

更新时间: 2024-02-05 14:15:48
品牌 Logo 应用领域
安森美 - ONSEMI 测试二极管
页数 文件大小 规格书
8页 58K
描述
39V, 1W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, DO-41, PLASTIC, CASE 59-10, 2 PIN

3EZ39D5RL 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:DO-41包装说明:O-PALF-W2
针数:2Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.57外壳连接:ISOLATED
配置:SINGLE二极管元件材料:SILICON
二极管类型:ZENER DIODE最大动态阻抗:28 Ω
JEDEC-95代码:DO-41JESD-30 代码:O-PALF-W2
JESD-609代码:e0元件数量:1
端子数量:2最高工作温度:200 °C
最低工作温度:-65 °C封装主体材料:PLASTIC/EPOXY
封装形状:ROUND封装形式:LONG FORM
峰值回流温度(摄氏度):NOT SPECIFIED极性:UNIDIRECTIONAL
最大功率耗散:1 W认证状态:Not Qualified
标称参考电压:39 V子类别:Voltage Reference Diodes
表面贴装:NO技术:ZENER
端子面层:TIN LEAD端子形式:WIRE
端子位置:AXIAL处于峰值回流温度下的最长时间:NOT SPECIFIED
最大电压容差:5%工作测试电流:19 mA
Base Number Matches:1

3EZ39D5RL 数据手册

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3EZ4.3D5 Series  
APPLICATION NOTE  
Since the actual voltage available from a given zener  
diode is temperature dependent, it is necessary to determine  
junction temperature under any set of operating conditions  
in order to calculate its value. The following procedure is  
recommended:  
DT is the increase in junction temperature above the lead  
temperature and may be found from Figure 2 for a train of  
power pulses (L = 3/8 inch) or from Figure 10 for dc power.  
JL  
DTJL = qJL PD  
For worst-case design, using expected limits of I , limits  
Z
Lead Temperature, T , should be determined from:  
L
of P and the extremes of T (DT ) may be estimated.  
D
J
J
TL = qLA PD + TA  
Changes in voltage, V , can then be found from:  
Z
q
is the lead-to-ambient thermal resistance (°C/W) and  
LA  
DV = qVZ DTJ  
P is the power dissipation. The value for q will vary and  
D
LA  
q
, the zener voltage temperature coefficient, is found  
VZ  
depends on the device mounting method. q is generally  
LA  
from Figures 5 and 6.  
30–40°C/W for the various clips and tie points in common  
use and for printed circuit board wiring.  
Under high power-pulse operation, the zener voltage will  
vary with time and may also be affected significantly by the  
zener resistance. For best regulation, keep current  
excursions as low as possible.  
Data of Figure 2 should not be used to compute surge  
capability. Surge limitations are given in Figure 3. They are  
lower than would be expected by considering only junction  
temperature, as current crowding effects cause temperatures  
to be extremely high in small spots resulting in device  
degradation should the limits of Figure 3 be exceeded.  
The temperature of the lead can also be measured using a  
thermocouple placed on the lead as close as possible to the  
tie point. The thermal mass connected to the tie point is  
normally large enough so that it will not significantly  
respond to heat surges generated in the diode as a result of  
pulsed operation once steady-state conditions are achieved.  
Using the measured value of T , the junction temperature  
L
may be determined by:  
TJ = TL + DTJL  
http://onsemi.com  
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