Alca te l 1905 LMI
Up to 20 m W WDM L-b a n d ve rsion for e xte rn a l m od ula tion
CW 1.55 µm La se r Mod ule with op tica l Isola tor
De scrip tion
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Optimized for use with LiNbO3 external
modulator
Polarization maintaining fiber pigtail
InGaAsP Distributed FeedBack SLMQW (DFB)
laser
This laser module contains an Alcatel
SLMQW DFB laser and is designed for use
with external modulation optimized for high
power Wavelength Division Multiplexed
(WDM) systems. The module incorporates a
polarization maintaining fiber pigtail,
thermoelectric cooler, precision thermistor,
and optical isolator for stable operation
under all conditions.
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Integral optical isolator
Internal TEC and monitor photodiode
Industry-standard hermetic 14-pin butterfly
package
Ap p lica tion s
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Ultra long haul DWDM synchronous digital
transmission systems
WDM submarine terminal digital transmission
systems
Fe a ture s
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Up to 20 mW output power
Wavelength selection according to
ITU-T G.692 (L-band)
Instrumentation.
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50 GHz spacing available
Op tica l ch a ra cte ristics
Pa ra m e te r
Threshold current
Output power
Sym b .
Con d ition s
Min
Typ ica l
Ma x
40
Un its
mA
mW
mW
V
I
th
PF
Twave = 15 to 30 °C
Twave = 15 to 25 °C
Pf, pin 3 & 11
10 mW, pin 3 & 11
20 mW, pin 3 & 11
10
20
Forward voltage
Laser forward current
V
2.5
120
210
F
IF
mA
mA
Emission wavelength
∆(Emitted-Target) Wavelength
Laser chip temperature range for tunability
See table 1
λm
∆λe
Tλ
@Tchip[2]
@10mW [2]
@20mW [2]
- 0.1
15
15
+ 0.1
30
nm
°C
25
°C
Spectral width
CW, Pf, FWHM
Pf
10MHz to 10 GHz @ Pf
V = -5 V
5
MHz
dB
dB/Hz
nA
pm/°C
k=Ω
%/K
A
∆λ
SMSR
RIN
Side mode suppression ratio
Relative Intensity Noise
Photodiode dark current
Wavelength drift vs Tcase
Thermistor resistance
Thermistor temperature coefficient
TEC current
35
-140
100
0.5
10.3
- 5
Id
∆λ/∆Tc
R
9.7
- 3
TH
R
t
I
[1]
[1]
1.3
2.5
t
TEC voltage
V
t
V
TE/TM fiber extinction ratio of pigtail
Er
20
dB
Note : All limits start of life (except It, Vt), Tsubmount = 25 °C, Tcase = 25 °C, Pf = 20 mW, monitor bias – 5 V, unless otherwise stated
[1] Tcase = 70° C, Tsubmount = 20 °C, P = 20 mW
[2] Tchip = Tλ .Tλ is chip temperature required to meet target wavelength (see table 1)
Ab solute m a xim um ra tin g s
Pa ra m e te rs
Operating case temperature
Storage temperature
Laser forward current
Laser reverse voltage
Photodiode forward current
Photodiode reverse voltage
TEC Voltage
Min
-10
-40
Ma x
70
85
350
2
1
Un it
°C
°C
mA
V
mA
V
V
A
s
Nm
20
2.8
1.4
10
TEC Current
Lead soldering time (at 260°C)
Packing Mounting Screw Torque
[1] Human body model.
0.2
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only.