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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 39-30-6185 | MOLEX |
获取价格 |
MINI-FIT JR. VERTICAL HEADER ASSEMBLIES WITH MOUNTING PEGS |
|
| 39-30-6186 | MOLEX |
获取价格 |
MINI-FIT JR. VERTICAL HEADER ASSEMBLIES WITH MOUNTING PEGS |
|
| 39-30-6187 | MOLEX |
获取价格 |
4.20mm (.165") Pitch Mini-Fit Jr. Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB |
|
| 39-30-6188 | MOLEX |
获取价格 |
4.20mm (.165") Pitch Mini-Fit Jr. Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB |
|
| 39-30-6204 | MOLEX |
获取价格 |
Rectangular Power Connector, 20 Contact(s), Male, Solder Terminal, LEAD FREE |
|
| 39-30-6205 | MOLEX |
获取价格 |
MINI-FIT JR. VERTICAL HEADER ASSEMBLIES WITH MOUNTING PEGS |
|
| 39-30-6206 | MOLEX |
获取价格 |
MINI-FIT JR. VERTICAL HEADER ASSEMBLIES WITH MOUNTING PEGS |
|
| 39-30-6207 | MOLEX |
获取价格 |
4.20mm (.165") Pitch Mini-Fit Jr.™ Header, Du |
|
| 39-30-6208 | MOLEX |
获取价格 |
4.20mm (.165") Pitch Mini-Fit Jr. Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB |
|
| 39-30-6222 | MOLEX |
获取价格 |
4.20mm (.165") Pitch Mini-Fit Jr. Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB |
|
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
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