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33661

更新时间： 2024-11-29 02:58:31

品牌	Logo	应用领域
飞思卡尔 - FREESCALE		电感器
页数	文件大小	规格书
21页	566K
描述
Local Area Network (LIN) Enhanced Physical Interface with Selectable Slew Rate

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33661 数据手册

Document Number: MC33661

Rev. 6.0, 11/2006

Freescale Semiconductor

Advance Information

Local Area Network (LIN)

Enhanced Physical Interface

with Selectable Slew Rate

33661

Local Interconnect Network (LIN) is a serial communication protocol

designed to support automotive networks in conjunction with Controller

Area Network (CAN). As the lowest level of a hierarchical network, LIN

enables cost-effective communication with sensors and actuators

when all the features of CAN are not required.

LIN PHYSICAL INTERFACE

The 33661 is a Physical Layer component dedicated to automotive

LIN sub-bus applications. It offers slew rate selection for optimized

operation at 10 kbps and 20 kbps, fast baud rate (above 100 kbps) for

test and programming modes, excellent radiated emission

performance, and safe behavior in the event of LIN bus short-to-ground

or LIN bus leakage during low-power mode.

The 33661 is compatible with LIN Protocol Specification 2.0.

D SUFFIX

EF SUFFIX (PB-FREE)

98ASB42564B

Features

• Operational from V_SUP6.0 V to 18 V DC, Functional up to 27 V DC,

and Handles 40 V During Load Dump

8-PIN SOICN

• Active Bus Waveshaping Offering Excellent Radiated Emission

Performance

• 5.0 kV ESD on LIN Bus Pin

• 30 kΩ Internal Pullup Resistor

• LIN Bus Short-to-Ground or High Leakage in Sleep Mode

• -18 V to +40 V DC Voltage at LIN Pin

• 8.0 µA in Sleep Mode

• Local and Remote Wake-Up Capability Reported by INH and

RXD Pins

ORDERING INFORMATION

Temperature

Device

Package

Range (T )

MC33661D/R2

-40°C to 125°C

8 SOICN

MCZ33661EF/R2

• 5.0 V and 3.3 V Compatible Digital Inputs Without Any External

Components Required

• Pb-Free Packaging Designated by Suffix Code EF

V_PWR

33661

WAKE

VSUP

INH

V_DD

Regulator

12 V

MCU

LIN Bus

RXD

TXD

5.0 V

LIN

GND

Figure 1. 33661 Simplified Application Diagram

* This document contains certain information on a new product.

Specifications and information herein are subject to change without notice.

12 3 4 5 6 7...21

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