30N06
Power MOSFET
ELECTRICAL CHARACTERISTICS (TC = 25℃, unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN TYP MAX UNIT
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
Drain-Source Leakage Current
BVDSS
IDSS
VGS = 0 V, ID = 250 μA
VDS = 60 V, VGS = 0 V
VGS = 20V, VDS = 0 V
60
V
10
μA
Forward
Reverse
100 nA
-100 nA
V/℃
Gate-Source Leakage Current
IGSS
VGS = -20V, VDS = 0 V
ID =250μA, Referenced to 25℃
△BVDSS/△TJ
Breakdown Voltage Temperature Coefficient
ON CHARACTERISTICS
Gate Threshold Voltage
Static Drain-Source On-State Resistance
DYNAMIC CHARACTERISTICS
Input Capacitance
0.06
32
VGS(TH)
RDS(ON)
VDS = VGS, ID = 250 μA
2.0
4.0
40
V
VGS = 10 V, ID = 15 A
mΩ
CISS
COSS
CRSS
800
300
80
pF
pF
pF
VGS = 0 V, VDS = 25 V,
f = 1MHz
Output Capacitance
Reverse Transfer Capacitance
SWITCHING CHARACTERISTICS
Turn-On Delay Time
tD(ON)
tR
tD(OFF)
tF
12
79
50
52
20
6
ns
ns
Turn-On Rise Time
VDD = 30V, ID =15 A, VGS=10V
(Note 1, 2)
Turn-Off Delay Time
ns
Turn-Off Fall Time
ns
Total Gate Charge
QG
30
nC
nC
nC
VDS = 60V, VGS = 10 V,
ID = 24A (Note 1, 2)
Gate-Source Charge
QGS
QGD
Gate-Drain Charge
9
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Drain-Source Diode Forward Voltage
Maximum Continuous Drain-Source Diode
Forward Current
VSD
VGS = 0 V, IS = 30A
1.4
30
V
A
IS
Maximum Pulsed Drain-Source Diode
Forward Current
ISM
120
A
Notes: 1. Pulse Test : Pulse width ≤300μs, Duty cycle ≤ 2%
2. Essentially independent of operating temperature.
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