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3090-330KJS PDF预览

3090-330KJS

更新时间: 2024-11-20 13:04:27
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3090-330KJS 数据手册

  
3090R  
3090  
SERIES  
Micro i® Low Profile Chip Inductors  
SERIES 3090 IRON CORE  
0.010  
0.015  
0.022  
0.033  
0.039  
0.047  
0.056  
0.068  
0.082  
0.10  
0.12  
0.15  
0.18  
0.22  
0.27  
0.33  
0.39  
0.47  
0.56  
0.68  
0.82  
1.00  
1.20  
1.50  
1.80  
2.20  
2.70  
3.30  
3.90  
4.70  
5.60  
6.80  
8.20  
20%  
20%  
20%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
42  
42  
40  
40  
40  
38  
35  
30  
25  
32  
32  
32  
32  
34  
34  
34  
34  
34  
34  
30  
28  
24  
24  
24  
24  
25  
25  
25  
25  
24  
22  
22  
22  
20  
50.0  
50.0  
50.0  
50.0  
50.0  
50.0  
50.0  
50.0  
50.0  
25.0  
25.0  
25.0  
25.0  
25.0  
25.0  
25.0  
25.0  
25.0  
25.0  
25.0  
25.0  
25.0  
7.9  
1000  
1000  
1000  
900  
900  
900  
800  
700  
650  
510  
410  
370  
330  
300  
250  
220  
200  
180  
160  
140  
120  
100  
95  
0.095  
0.115  
0.140  
0.185  
0.100  
0.110  
0.135  
0.16  
0.19  
0.08  
0.10  
0.12  
0.14  
0.16  
0.20  
0.25  
0.30  
0.36  
0.45  
0.50  
0.60  
0.70  
1.10  
1.20  
1.25  
1.30  
1.50  
1.90  
2.30  
3.00  
3.50  
4.00  
4.50  
5.00  
890  
810  
765  
640  
870  
830  
750  
690  
630  
970  
870  
795  
765  
690  
615  
550  
500  
460  
410  
390  
355  
330  
265  
250  
245  
240  
225  
200  
180  
160  
145  
135  
130  
120  
-100M  
-150M  
-220M  
-330K  
-390K  
-470K  
-560K  
-680K  
-820K  
-101K  
-121K  
-151K  
-181K  
-221K  
-271K  
-331K  
-391K  
-471K  
-561K  
-681K  
-821K  
-102K  
-122K  
-152K  
-182K  
-222K  
-272K  
-332K  
-392K  
-472K  
-562K  
-682K  
-822K  
-103K  
Actual Size  
Physical Parameters  
Inches  
Millimeters  
1.27 Max.  
2.54 0.254  
2.54 0.254  
1.27 Min.  
A
B
C
D
E
F
0.050 Max.  
0.100 0.010  
0.100 0.010  
0.050 Min.  
0.015 Min. (Typ.)  
0.020 Max. (Typ.) 0.51 Max. (  
7.9  
7.9  
7.9  
7.9  
7.9  
7.9  
7.9  
7.9  
90  
85  
80  
70  
65  
60  
55  
53  
0.38 Min. (T  
yp.)  
Typ.)  
Current Rating at 90°C Ambient 35°C  
Rise  
Operating Temperature Range  
55°C  
to +125°C  
0.105 W  
proved  
Maximum Power Dissipation at 90°C  
7.9  
7.9  
7.9  
50  
45  
40  
Core Material Powdered iron core for im  
temperature stability.  
10.0  
Mechanical Configuration Units are ep  
oxy  
encapsulated. Contact area for reflow sold  
ering are gold  
plated per MIL-G-45204 Type 1 Grade A.  
connections are thermal compression bon  
Internal  
ded.  
Optional Tolerances: J = 5% H = 3% G = 2% F = 1%  
*Complete part # must include series # PLUS the dash #  
For surface finish information, refer to www.delevanfinishes.com  
Termination Finish Options  
Standard: Gold over Nickel.  
For Tin/Lead over Nickel: Add suffix “S” to  
allow an additional .010 inch for maximum  
RoHS, order 3090R - XXXKS.  
part number and  
height. For  
Notes 1) Designed specifically for reflow  
other high temperature processes with m  
exhibit solder fillet. 2) Self Resonant Freq  
soldering and  
etalized edges to  
uency (SRF)  
values 250 MHz and above are calculated  
reference only.  
and for  
Packaging Tape & reel (8mm): 7" reel, 2  
000 pieces max.;  
13" reel, 8000 pieces max.  
MIL-PRF-83446 (Reference) for testing m  
ethods only.  
Made in the U.S.A.  
.
270 Quaker Rd., East Aurora NY 14052 • Phone 716-652-3600 • Fax 716-652-4814 • E-mail: apisales@delevan com • www.delevan.com  
1/2009  

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