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3.0SMCxxX

更新时间： 2024-11-16 01:15:19

品牌	Logo	应用领域
力特 - LITTELFUSE		/
页数	文件大小	规格书
5页	899K
描述
The 3.0SMC series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events

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TransientVoltage Suppression Diodes

Surface Mount > 3.0SMC series

e3

Pb

RoHS

3.0SMC Series

Description

Uni-directional

The 3.0SMC series is designed specifically to protect

sensitive electronic equipment from voltage transients

induced by lightning and other transient voltage events.

Features

Maximum Ratings andThermal Characteristics

(T_A=25^OC unless otherwise noted)

• For surface mounted

applications in order to

optimize board space

• Fast response time:

typically less than 1.0ps

from 0V to BV min

• Excellent clamping

capability

• Low incremental surge

resistance

Parameter

Symbol

P_D

Value

6.5

Unit

W

Power Dissipation on Inﬁnite Heat

Sink atT_L=50^OC

• Low proﬁle package

•Typical failure mode is

short from over-speciﬁed

voltage or current

Peak Forward Surge Current, 8.3ms

Single Half Sine Wave (Note 1)

I_FSM

300

3.5

A

V

Maximum Instantaneous Forward

Voltage at 100A for Unidirectional

Only

• Whisker test is conducted • High temperature to reﬂow

V_F

based on JEDEC

JESD201A per its table 4a

and 4c

• IEC-61000-4-2 ESD

30kV(Air), 30kV (Contact)

• I_PPis speciﬁed @ 8/20µS

surge waveform

• Built-in strain relief

soldering guaranteed:

260°C/40sec

• Meet MSL level1, per

J-STD-020, LF maximun

peak of 260°C

• Matte tin lead–free plated

• Halogen free and RoHS

compliant

OperatingTemperature Range

StorageTemperature Range

T_J

-65 to 150

-65 to 175

°C

°C

T_STG

TypicalThermal Resistance Junction

to Lead

°C/W

R_θJL

R_θJA

15

75

TypicalThermal Resistance Junction

to Ambient

°C/W

Notes:

• V_BR@T_J= V_BR@25°C

x (1+αT x (T_J- 25))

(αT:Temperature

Coefﬁcient, typical value is

0.1%)

1. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional

device only, duty cycle=4 per minute maximum.

• Pb-free E3 means 2nd

level interconnect is

Pb-free and the terminal

ﬁnish material is tin(Sn)

(IPC/JEDEC J-STD-

609A.01)

Functional Diagram

• Glass passivated chip

junction

Cathode

Anode

Uni-directional

Additional Infomarion

Applications

TVS devices are ideal for the protection of I/O Interfaces,

_CCbus and other vulnerable circuits used inTelecom,

V

Computer, Industrial and Consumer electronic

applications.

Datasheet

Samples

Resources

© 2015 Littelfuse, Inc.

Speciﬁcations are subject to change without notice.

Revised: 11/20/15

12 3 4 5

中文翻译

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