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3.0SMC33A

更新时间: 2024-11-19 02:55:43
品牌 Logo 应用领域
力特 - LITTELFUSE 二极管
页数 文件大小 规格书
5页 899K
描述
The 3.0SMC series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events

3.0SMC33A 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.10.00.50风险等级:5.8
二极管类型:TRANS VOLTAGE SUPPRESSOR DIODEBase Number Matches:1

3.0SMC33A 数据手册

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TransientVoltage Suppression Diodes  
Surface Mount > 3.0SMC series  
e3  
Pb  
RoHS  
3.0SMC Series  
Description  
Uni-directional  
The 3.0SMC series is designed specifically to protect  
sensitive electronic equipment from voltage transients  
induced by lightning and other transient voltage events.  
Features  
Maximum Ratings andThermal Characteristics  
(TA=25OC unless otherwise noted)  
• For surface mounted  
applications in order to  
optimize board space  
• Fast response time:  
typically less than 1.0ps  
from 0V to BV min  
• Excellent clamping  
capability  
• Low incremental surge  
resistance  
Parameter  
Symbol  
PD  
Value  
6.5  
Unit  
W
Power Dissipation on Infinite Heat  
Sink atTL=50OC  
• Low profile package  
Typical failure mode is  
short from over-specified  
voltage or current  
Peak Forward Surge Current, 8.3ms  
Single Half Sine Wave (Note 1)  
IFSM  
300  
3.5  
A
V
Maximum Instantaneous Forward  
Voltage at 100A for Unidirectional  
Only  
• Whisker test is conducted • High temperature to reflow  
VF  
based on JEDEC  
JESD201A per its table 4a  
and 4c  
• IEC-61000-4-2 ESD  
30kV(Air), 30kV (Contact)  
• IPP is specified @ 8/20µS  
surge waveform  
• Built-in strain relief  
soldering guaranteed:  
260°C/40sec  
• Meet MSL level1, per  
J-STD-020, LF maximun  
peak of 260°C  
• Matte tin lead–free plated  
• Halogen free and RoHS  
compliant  
OperatingTemperature Range  
StorageTemperature Range  
TJ  
-65 to 150  
-65 to 175  
°C  
°C  
TSTG  
TypicalThermal Resistance Junction  
to Lead  
°C/W  
RθJL  
RθJA  
15  
75  
TypicalThermal Resistance Junction  
to Ambient  
°C/W  
Notes:  
• VBR @TJ= VBR@25°C  
x (1+αT x (TJ - 25))  
(αT:Temperature  
Coefficient, typical value is  
0.1%)  
1. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional  
device only, duty cycle=4 per minute maximum.  
• Pb-free E3 means 2nd  
level interconnect is  
Pb-free and the terminal  
finish material is tin(Sn)  
(IPC/JEDEC J-STD-  
609A.01)  
Functional Diagram  
• Glass passivated chip  
junction  
Cathode  
Anode  
Uni-directional  
Additional Infomarion  
Applications  
TVS devices are ideal for the protection of I/O Interfaces,  
CC bus and other vulnerable circuits used inTelecom,  
V
Computer, Industrial and Consumer electronic  
applications.  
Datasheet  
Samples  
Resources  
© 2015 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revised: 11/20/15  

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