Nexperia
2N7002PV
60 V, 350 mA dual N-channel Trench MOSFET
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol
Per device
Rth(j-a)
Parameter
Conditions
Min
Typ
Max
Unit
thermal resistance from in free air
junction to ambient
[1]
-
-
250
K/W
Per transistor
Rth(j-a)
thermal resistance from in free air
junction to ambient
[1]
[2]
-
-
-
330
280
-
380
320
115
K/W
K/W
K/W
Rth(j-sp)
thermal resistance from
junction to solder point
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 1 cm2.
017aaa064
3
10
duty cycle = 1
0.75
Z
th(j-a)
(K/W)
0.5
0.33
0.2
2
10
0.25
0.1
0.05
0.02
0.01
0
10
1
10
- 3
- 2
- 1
2
3
10
10
1
10
10
10
t
(s)
p
FR4 PCB; standard footprint
Fig. 4. Per transistor: Transient thermal impedance from junction to ambient as a function of pulse duration;
typical values
017aaa065
3
10
Z
th(j-a)
duty cycle = 1
0.75
(K/W)
0.5
0.33
2
10
0.25
0.1
0.2
0.05
0.02
0.01
0
10
1
10
- 3
- 2
- 1
2
3
10
10
1
10
10
10
t
(s)
p
FR4 PCB, mounting pad for drain 1 cm2
Fig. 5. Per transistor: Transient thermal impedance from junction to ambient as a function of pulse duration;
typical values
©
2N7002PV
All information provided in this document is subject to legal disclaimers.
Nexperia B.V. 2022. All rights reserved
Product data sheet
28 December 2022
5 / 14