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2N5461RLRA PDF预览

2N5461RLRA

更新时间: 2024-11-25 03:56:19
品牌 Logo 应用领域
安森美 - ONSEMI 晶体放大器晶体管
页数 文件大小 规格书
5页 60K
描述
JFET Amplifier P−Channel − Depletion

2N5461RLRA 技术参数

是否无铅: 含铅生命周期:Obsolete
零件包装代码:TO-92包装说明:CASE 29-11, 3 PIN
针数:3Reach Compliance Code:not_compliant
HTS代码:8541.21.00.95风险等级:5.01
其他特性:LOW NOISE配置:SINGLE
FET 技术:JUNCTION最大反馈电容 (Crss):2 pF
JEDEC-95代码:TO-92JESD-30 代码:O-PBCY-T3
JESD-609代码:e0元件数量:1
端子数量:3工作模式:DEPLETION MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:ROUND封装形式:CYLINDRICAL
峰值回流温度(摄氏度):240极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):0.31 W认证状态:Not Qualified
子类别:FET General Purpose Small Signal表面贴装:NO
端子面层:Tin/Lead (Sn/Pb)端子形式:THROUGH-HOLE
端子位置:BOTTOM处于峰值回流温度下的最长时间:30
晶体管应用:AMPLIFIER晶体管元件材料:SILICON
Base Number Matches:1

2N5461RLRA 数据手册

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2N5460, 2N5461, 2N5462  
JFET Amplifier  
P−Channel − Depletion  
Features  
Pb−Free Packages are Available*  
http://onsemi.com  
2 DRAIN  
MAXIMUM RATINGS  
Rating  
Drain − Gate Voltage  
Symbol  
Value  
40  
Unit  
Vdc  
3
V
DG  
GATE  
Reverse Gate − Source Voltage  
Forward Gate Current  
V
40  
Vdc  
GSR  
G(f)  
I
10  
mAdc  
1 SOURCE  
Total Device Dissipation @ T = 25°C  
P
D
350  
2.8  
mW  
mW/°C  
A
Derate above 25°C  
Junction Temperature Range  
Storage Channel Temperature Range  
T
65 to +135  
65 to +150  
°C  
°C  
J
T
stg  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
TO−92  
CASE 29  
STYLE 7  
1
2
3
MARKING DIAGRAM  
2N  
546x  
AYWWG  
G
2N546x = Device Code  
x = 0, 1, or 2  
A
= Assembly Location  
Y
= Year  
WW  
G
= Work Week  
= Pb−Free Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
Preferred devices are recommended choices for future use  
and best overall value.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
March, 2006 − Rev. 5  
2N5460/D  

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