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2DEA-2-W20T PDF预览

2DEA-2-W20T

更新时间： 2024-11-14 20:39:11
品牌 Logo 应用领域
伯恩斯 - BOURNS 局域网光电二极管
页数 文件大小 规格书
2页 101K
描述
Trans Voltage Suppressor Diode, Bidirectional, 20 Element, Silicon, MS-013, SOIC-20

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2DEA-2-W20T 技术参数

生命周期：Obsolete零件包装代码：SOIC
包装说明：R-PDSO-G20针数：20
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8541.10.00.50风险等级：5.84
配置：COMPLEX二极管元件材料：SILICON
二极管类型：TRANS VOLTAGE SUPPRESSOR DIODEJESD-30 代码：R-PDSO-G20
JESD-609代码：e0元件数量：20
端子数量：20封装主体材料：PLASTIC/EPOXY
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
极性：BIDIRECTIONAL认证状态：Not Qualified
表面贴装：YES技术：AVALANCHE
端子面层：TIN LEAD端子形式：GULL WING
端子位置：DUALBase Number Matches：1

2DEA-2-W20T 数据手册

 浏览型号2DEA-2-W20T的Datasheet PDF文件第2页 
Features  
Applications  
ꢀ Parallel printer ports, communication  
ports  
ꢀ Supports 15 KV IEC 61000-4-2 ESD  
equipment specification†  
DEA002  
24Q  
ꢀ Single device protects as many as 20 lines  
on exposed pins, communications ports  
ꢀ Hot-swappable designs  
ꢀ IC protection  
0036  
ꢀ Incorporates 40 bi-directional PN  
junction diodes  
ꢀ Small form factor replaces 20 SOT23  
packages  
Thin Film on Silicon 2DEA Integrated ESD Protection Diode Array  
General Information  
Package Schematic  
How To Order  
2 DEA - 2 - Q 24 R  
The Model 2DEA Series is well-suited for  
space constrained designs where the  
requirements of international ESD standard  
specification IEC 61000-4-2 must be met.  
These highly integrated PN junction  
diode arrays are especially effective for  
use in PC notebooks and motherboards,  
engineering workstations and portable  
battery-powered devices such as PDAs  
and cellular phones.  
Space savings, as compared to popular  
BAV99 SOT23 based implementations, can  
yield a 75 % reduction in utilized board  
area. In addition, significant assembly cost  
reductions and manufacturing integrity  
improvements can be realized.  
VDD  
VSS  
Product Class  
Thin-Film-on-Silicon  
24 23 22 21 20 19 18 17 16 15 14 13  
Product Function  
ESD Protection Diode Array  
DEA = 20 Lines  
DEB = 17 Lines  
Standard  
Standard Package Style  
Q =  
QSOP  
W = Wide-Body SOIC  
1
2
3
4
5
6
VSS  
7
8
9
10 11 12  
VDD  
Pin Count  
Q = 24  
W = 20  
Dispensing  
R = Reel T = Tube  
Typical Part Marking  
Two package options are available.  
Model 2DEA consists of 20 bi-directional  
diode pairs in a miniature 24-pin JEDEC  
QSOP package. The 2DEB consists of 17  
bi-directional diode pairs in a traditional  
wide-body SOIC JEDEC package.  
Represents total content. Layout may vary.  
PRODUCT  
FUNCTION  
DEA002  
Standard Part Numbers  
PIN COUNT  
24Q  
PACKAGE STYLE  
DATE CODE  
YYWW  
Part Number  
(Tape & Reel)  
Part Number  
PIN 1 INDICATOR  
(MOLDED INDENT)  
Electrical Specifications  
(Tubes)  
MANUFACTURER'S  
TRADEMARK  
Supply Voltage (VDD - VSS)  
...........................................-0.3 V to +12 V  
Voltage @ Any Channel (Vin)  
2DEA-2-Q24R  
2DEA-2-Q24T  
2DEB-2-W20R  
2DEB-2-W20T  
....................................-0.3 V to (VDD+0.5)  
VSS = GND  
Channel Clamp Current (lc)  
(Continuous) .........................±15 mA max.  
Forward Voltage (Vf)  
@ lf = 1 mA..............0.8 V typ., 0.9 V max.  
@ lf =12 mA ..............................1.5 V max.  
Leakage Current  
@ VSS < Vin < VDD = 12 V ......0.1 µA typ.  
@ VSS < Vin < VDD = 12 V .....10 µA max.  
Diode Capacitance ......................5 pF max.  
Diode Power Rating ...............20 mW/diode  
Power Dissipation @ 25 °C.............100 mw  
ESD Protection†..15 KV per IEC 61000-4-2  
human body test method  
Environmental Specifications  
Operating Temperature.-55 °C to +125 °C  
Storage Temp. Range...-65 °C to +150 °C  
Physical Specifications  
Standard Packages and Pin Counts  
QSOP.............................................24 Pin  
Wide-Body SOIC ...........................20 Pin  
Dispensing  
QSOP .......................3,500 pcs./13 ” reel  
56 pcs./tube  
Wide-Body SOIC......3,500 pcs./13 ” reel  
37 pcs./tube  
† Note: IEC 61000-4-2 ESD test performance is measured at the systems level and system designs, enclosure shielding and other conventional ESD control measures usually influence  
the results of these tests. Testing on the component level serves as an indicator that the system passes a specific compliance step, but does not ensure that the system passes at that  
level. The Model 2DEA/DEB device, therefore, can support successful implementation of the IEC 61000-4-2 system level ESD standard.  
Specifications are subject to change without notice.  
12

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