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2980-0000-62 PDF预览

2980-0000-62

更新时间: 2024-11-15 23:19:39
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其他 - ETC 连接器
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描述
OSMP Microminiature Push-On Coaxial Connectors

2980-0000-62 数据手册

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ID 1020  
V3.00  
OSMP Microminiature  
Push-On Coaxial Connectors  
• Intermateable with Gilbert GPO™ Series  
• DESC approved  
• Enhanced performance features  
• Simplified Assembly  
M/A-COM’s OSMP microminiature push-on coaxial connectors  
provide solutions for today’s modular designs with denser pack-  
aging requirements. The extremely small size of the OSMP  
offers a versatile solution for high density packaging allowing  
connector center-to-center spacing of 0.170". The push-on  
interface facilitates easier assembly and test with a positive  
snap-in feature to indicate a fully mated connection. The rugged  
OSMP interface can withstand harsh environments of mechani-  
cal shock and vibration, typically found in military or aerospace  
related applications. M/A-COM’s OSMP connector interface is  
the standard used by Defense Electronics Supply Center  
(DESC) to generate the SMP push-on connector series.  
OSMP Shroud and Jack to Jack Adapter Assembly  
OSMP connectors can be your design solution for mechanical  
packaging and frequency response. The OSMP interface pro-  
vides 0.020" of radial misalignment for critical blindmate applica-  
tions. Mating forces are strictly controlled to ensure reliable  
connections per mated pair or when simultaneouslymating mul-  
tiple connectors. Cable jacks include an anti-rocking ring to  
ensure reliable mechanical performance regardless of the oper-  
ating environment. OSMP connectors offer enhanced broadband  
VSWR performance of 1.15:1 max thru 26GHz and 1.40:1 max  
thru 40GHz.  
Standard design OSMP configurations include cableconnectors,  
straight and right angle, for 0.047 and 0.085 semi-rigid cable,  
full detent, limited detent and smooth bore mating shrouds that  
can be bulkhead or flange mounted and glass feedthroughs for  
coax to circuit launchers. In-series adapters for module to mod-  
ule intermating and between series adapters for integrating or  
testing systems or components parameters.  
1.50:1  
1.40:1  
1.30:1  
1.20:1  
1.10:1  
OSMP connectors are an ideal solution for upgrading existing  
systems or creating new high density designs for next generation  
RF packaging. Years of design experience has made M/A-COM  
an industry leader in blindmate modular interconnect technology.  
Call your local M/A-COM Sales Office or authorized Distributor  
for more information or samples of our new OSMP series.  
0.0  
8.0  
16.0  
24.0  
32.0  
40.0 GHz  
Typical VSWR for OSMP Jack to Jack Adapter  
Part Numbers 2980-0000-62 and 2998-5001-02  
Specifications Subject to Change Without Notice.  
M/A-COM, Inc.  
1
North America: Tel. (800) 366-2266  
Fax (800) 618-8883  
Asia/Pacific: Tel. +81 3 3263 8761  
Fax +81 3 3263 8769  
Europe: Tel. +44 (1344) 869 595  
Fax +44 (1344) 300 020  

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