Datasheet > 28C0236-0DW-10

28C0236-0DW-10

更新时间： 2024-11-24 12:54:39

品牌	Logo	应用领域
其他 - ETC		/
页数	文件大小	规格书
3页	310K
描述
Part Number Nomenclature

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

28C0236-0DW-10 数据手册

Part Number Nomenclature

Board Level Products

HI2220P601R-10 (Part number example in BOLD)

2220

601

Impedance ( Z )

or Inductance ( L )

Value Code

-10

Rated

Product Series

Code

Part Size

Code

Packaging

Code

Addtional

Description

Continuous

Current Code

HI = High Current Chip Beads

(>3,000 mA)

0402

0603

0805

1206

1210

1612

1806

1812

1922

2021

2220

2520

2545

2722

3032

3312

3322

3421

3822

4545

4732

5022

5441

6032

A < 100 mA

B = 200 mA

C = 300 mA

D = 400 mA

E = 500 mA

F = 600 mA

G = 700 mA

H = 800 mA

I = 900 mA

J = 1,000 mA

K = 1,500 mA

L = 2,000 mA

First two numbers

are Signiﬁcant Digits.

The last number

indicates how many

zeros are added to

the signiﬁcant digits

for impedance.

B = Bulk Standard 00 = Legacy Part

Thru-Hole

Packaging

Contains Lead

MI = Mid Current Chip Beads

(>1,000 mA to <3,000 mA)

-10 = Lead Free

R = Tape & Reel

Standard SMT

Package

Standard Catalog

Part

LI = Low Current Chip Beads

(<1,000 mA, <400 W Z)

HZ = High Impedance

Chip Beads

-11 to -99 = Non Standard

or Custom Part

Impedance

Examples

(<1,000 mA, >400 W Z)

HF = High Frequency

Chip Beads

100 = 10 OHMS

101 = 100 OHMS

LF = Low Frequency

Chip Beads

M = 2,500 mA 102 = 1,000 OHMS

202 = 2,000 OHMS

060 = 6 OHMS

600 = 60 OHMS

601 = 600 OHMS

N = 3,000 mA

O = 3,500 mA

P = 4,000 mA

Q = 4,500 mA

R = 5,000 mA

S = 5,500 mA

T = 6,000 mA

U = 7,000 mA

V = 8,000 mA

W = 9,000 mA

X = 10,000 mA

HR = High Bias Retention

Chip Beads

(>3,000 mA)

CC = CAN-Bus Common Mode

CM = Common Mode

DI = Power Inductor

Inductance

Examples

470 = 47 nH

DA = Multiline Array Chip

IC = Chip Inductor

471 = 470 nH

472 = 4,700 nH

473 = 47,000 nH

Y = 15,000 mA 474 = 470,000 nH

475 = 4,700,000 nH

Z > 20,000 mA

29F08ꢀ8-ꢀSR-ꢀ0 (Part number example in BOLD)

0818

-1

Minor

Dimension

Code

-10

Part Size

Code

Board Mounting

Style

Additional Part

Description

Material Type

Product Type Code

Packaging Code

28 & 29 = Broad

Band Material

C = Choke

L = Axial Leaded

Bead

F = Assembled

Part

Unique Part

Identiﬁer or

Signiﬁcant

Dimension

Height or S = Surface Mount O = Bulk Standard

-10 = Lead Free

Standard

Catalog

Length

T = Thru-Hole

R = Tape & Reel

Standard SMT

Package

Variation

35 = Low Frequency

Material

Part

-11 to -99 =

Non Standard or

Custom Part

J = Radial Leaded

Bead

www.steward.com

www.lairdtech.com

SIP-BRO-PNN-0707

ꢀ

12 3

中文翻译

下载PDF

与28C0236-0DW-10相关器件

型号	品牌	获取价格	描述	数据表
28C04A	MICROCHIP	获取价格	4K (512 x 8) CMOS EEPROM
28C04A/AF	ETC	获取价格	Parallel EEPROM
28C04A/L	MICROCHIP	获取价格	4K (512 x 8) CMOS EEPROM
28C04A/P	MICROCHIP	获取价格	4K (512 x 8) CMOS EEPROM
28C04A_04	MICROCHIP	获取价格	4K (512 x 8) CMOS EEPROM
28C04A-15/J	MICROCHIP	获取价格	512 X 8 EEPROM 5V, 150 ns, CDIP24, CERDIP-24
28C04A-15/K	MICROCHIP	获取价格	512 X 8 EEPROM 5V, 150 ns, CQCC32, CERAMIC, LCC-32
28C04A-15/L	MICROCHIP	获取价格	4K (512 x 8) CMOS EEPROM
28C04A-15/P	MICROCHIP	获取价格	4K (512 x 8) CMOS EEPROM
28C04A-15E/L	MICROCHIP	获取价格	IC,EEPROM,512X8,CMOS,LDCC,32PIN,PLASTIC

与28C0236-0DW-10相关文章

解析光耦仿真器：升级光耦合器技术的必要性
2024-11-18

39
英伟达新一代Blackwell GPU过热问题致交付延迟
2024-11-18

31
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

59
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

55

产品中心

服务支持

精选活动

关于我们

帮助中心

28C0236-0DW-10

28C0236-0DW-10 数据手册

与28C0236-0DW-10相关器件

与28C0236-0DW-10相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

28C0236-0DW-10

28C0236-0DW-10 数据手册

与28C0236-0DW-10相关器件

与28C0236-0DW-10相关文章

您还可以找

您在本页遇到什么问题？