Datasheet > 26100-B1

26100-B1

更新时间： 2024-11-24 07:20:39

品牌	Logo	应用领域
泰科 - TE		放大器
页数	文件大小	规格书
4页	131K
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Electrical Characterization of Packages for Use with GaAs MMIC Amplifiers

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Application Note

M542

Electrical Characterization of Packages for Use with GaAs

MMIC Amplifiers

Rev. V4

Abstract

Package Description

Manufacturer

A test methodology will be presented which combines

the advantage of on-wafer RF probing with a TRL

calibration to create a completely de-embeddable,

novel “test fixture” capable of electrically characteriz-

ing most any style package or device. This scheme

has been used to characterize many of the currently

available microwave packages in order to identify ap-

propriate packages for our MMIC amplifier products

which cover frequencies up to 12 GHz. In addition,

the technique has been employed to characterize in-

jection-molded plastic packages and to evaluate non-

probeable MMIC's.

5 lead, ceramic

6 lead, ceramic

Kyocera

Leadless, 6 port, ceramic

7 lead, ceramic

StratEdge

Kyocera

8 lead, ceramic

Kyocera

8 lead, glass

Mini-Systems

Oxley

8 lead, glass, ground straps

Leadless, 8 port, ceramic

Leadless, 10 port, ceramic

Introduction

Alcoa

Most package vendors have very little microwave

design and characterization capability. Their lim-

ited characterization efforts typically involve the use

of poor fixturing, which obscures the true frequency

response of the package. Companies specializing

in fixturing, while investing considerable mechani-

cal engineering effort, expend far less on electrical

considerations, often producing fixtures inadequate

for use at microwave frequencies. Consequently,

there is very little microwave performance data

available from package vendors.

Table 1. Summary of Packages

Design Approach

To eliminate the need for expensive, device spe-

cific, traditional fixtures and overcome their fre-

quency limitations, an RF probeable ceramic sub-

strate was designed as the interface to the device-

under-test (DUT). Figure 1 illustrates this coplanar

probe to microstrip transition. It is a 50 ohm line

fabricated on 10-mil thick alumina, with an 8-mil

pitch, ground-signal-ground (G-S-G) probe pattern

at one end. The two ground pads are connected to

the substrate backside with 8-mil diameter plated

vias. The G-S-G pattern can be probed using com-

mercially available microwave probes on a stan-

dard microwave probe station. The opposite end of

the substrate can be bonded to a test port of the

DUT.

Therefore, to evaluate and identify candidate pack-

ages for each of the amplifiers in our MMIC ampli-

fier product line, specific fixturing had to be devel-

oped for each package style considered. A novel

fixturing approach was designed and implemented,

which not only eliminates the need for expensive,

package specific fixtures, but also overcomes the

frequency limitations of traditional connectorized,

plunger-style fixtures. Additionally, a rigorous cali-

bration method was developed which allows com-

plete fixture de-embedding.

To complete the “test fixture,” only a thin brass

block is required to serve as the mounting surface

for the ceramic substrates and the DUT. If neces-

sary, the brass block could be machined to com-

pensate for any difference in height between the

substrate and DUT test port. To fixture practically

any DUT, all that is needed is a brass plate and the

probeable ceramic substrates. Figure 2 shows the

configuration used for characterizing our

MAAM71200-H1, a packaged 7-12 GHz GaAs

MMIC low noise amplifier.

This test methodology is applicable to practically

any style device. Table 1 lists the package styles

investigated. Through this work, proper electrical

characterization of commonly used packages has

indicated useful frequency ranges broader than

expected by even the package manufacturers.

This finding has allowed us to use low-cost pack-

ages for frequency applications where our competi-

tors typically resort to high-priced custom pack-

ages.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

Visit www.macomtech.com for additional data sheets and product information.

• India Tel: +91.80.4155721

• China Tel: +86.21.2407.1588

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

12 3 4

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与26100-B1相关器件

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26100C	MURATA	获取价格	Bobbin Wound Surface Mount Inductors
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26101E3	VISHAY	获取价格	Aluminum Capacitors Axial High Temperature, DIN-Based
26-10-2051	MOLEX	获取价格	Board Connector, 5 Contact(s), 1 Row(s), Male, Right Angle, 0.156 inch Pitch, Solder Termi
26-10-2061	MOLEX	获取价格	Board Connector, 6 Contact(s), 1 Row(s), Male, Right Angle, 0.156 inch Pitch, Solder Termi
26-10-2081	MOLEX	获取价格	Board Connector, 8 Contact(s), 1 Row(s), Male, Right Angle, 0.156 inch Pitch, Solder Termi
26-10-2101	MOLEX	获取价格	Board Connector, 10 Contact(s), 1 Row(s), Male, Right Angle, 0.156 inch Pitch, Solder Term
26-10-2171	MOLEX	获取价格	Board Connector, 17 Contact(s), 1 Row(s), Male, Right Angle, 0.156 inch Pitch, Solder Term
26-10-2201	MOLEX	获取价格	Board Connector, 20 Contact(s), 1 Row(s), Male, Right Angle, 0.156 inch Pitch, Solder Term

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