Datasheet > 256-BG16001-71V

256-BG16001-71V

更新时间： 2024-11-25 23:19:19

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IC SOCKET BGA 256 WAY

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中文翻译

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256-BG16001-71V 数据手册

BallLock^™BGA Socket

Covered by patents and/or patents applied for.

FEATURES:

• Any grid size available on either 1.27mm [.050”] or 1.50mm [.059”]

pitch.

• Lidless design - ball locks into two-fingered contact.

• Ultra-low profile socket adds only .050 [1.27] to overall package height

(.100 [2.54] with SnapAdapt™ pins).

• Optional Corner guides aid in package insertion (not used with

SnapAdapt™ pins).

• Consult Data Sheet Nos. 23003 and 23004 for Aries BallNest™

Socket.

SPECIFICATIONS:

• Socket body is UL 94V-0 FR-4.

• Optional lead-in guides are black UL 94V-0 glass-filled Thermoplastic

(PPS).

• Contacts are Beryllium Copper Alloy per QQ-C-533.

• Contact plating is either 100µ [2.54µm] min. 90/10 Tin/Lead per MIL-T-

10727 or 10µ [.25µm] min. Gold per MIL-G-45204 over 30µ [.76µm]

Nickel per QQ-N-290.

• Solder ball terminations are 90/10 Lead/Tin.

• Solder paste is 63/37 eutectic.

Note: Aries specializes in custom design and production. In addition to the

standard products shown on this page, special materials, platings, sizes, and

configurations can be furnished, depending on quantities. Aries reserves the

right to change product specifications without notice.

• Solder mask is “dryfilm.”

• Inductance≤1ηH/cont. @ 100MHz approx. (under testing).

• Capacitance≤1pf/contact @ 100MHz approx. (under testing).

• Contact resistance=10mOhms initial, 20mOhms @10 cycles

(under testing).

ORDERING INFORMATION

(for socket w/out corner guides only)

XXX-BGXXXXX-7XX

• Durability=10 cycles max.; up to 50 cycles with SnapAdapt^TMpin.

• Insertion Force=50 grams/contact avg. (approximate);

40 grams/contact initial when used with SnapAdapt^TMpin.

• Withdrawal Force=20 grams/contact max. (approximate).

• Socket accepts BGA devices with .030 [.76] dia. balls.

MOUNTING CONSIDERATIONS:

Pitch

U=1.50mm

V=1.27mm

No. of positions

(256 shown)

Ball Grid Array

Plating:

0=Tin

1=Gold

Footprint designator

(assigned by factory)

• Suggested PCB pad size=.025±.003 [.64±.08] dia.

ALL DIMENSIONS: INCHES [MILLIMETERS]

Contact Type:

7=BallLock surface mount

solder ball contact

All tolerances ± .005 [.13]

unless otherwise specified

“A”=BGA PACKAGE SIZE + .085 [2.29]

“B”=(NO. OF POSITIONS PER ROW - 1) X BGA PITCH

“C”=BGA PACKAGE SIZE + .015 [.25]

Use Aries’ BGA

Note: Part number assigned by

“D”=BGA PACKAGE SIZE + .060 [1.52]

factory when ordering

socket with corner guides.

Order Sheet, Data

Sheet No. 23000, for

prompt quotations.

BGA Package with SMT

SnapAdapt™ pins in lieu of solder

balls. Consult Data Sheet No.

23012 and 23013 for details.

BGA Package w/ .030 [.76] dia.

solder balls

Optional

corner

guides

BallLock™ CONTACT

Corner guides not used

with SnapAdapt™ pins.

NORTH AMERICA

UK/IRELAND/GB

EUROPE/MAINLAND/HOLLAND

TEL: +31 78 615 94 65

Frenchtown, NJ USA

TEL: (908) 996-6841

FAX: (908) 996-3891

TEL: +44 870 240 0249

FAX: +44 1653 600493

uking@arieselec.com

FAX: +31 78 615 43 11

23002

REV.E

europe@arieselec.com

http://www.arieselec.com • info@arieselec.com

PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED

中文翻译

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256CH364X2SR	VISHAY	获取价格	RESISTOR, NETWORK, FILM, ISOLATED, 0.8 W, THROUGH HOLE MOUNT, SIP
256CH753X2PD	VISHAY	获取价格	RESISTOR, NETWORK, FILM, BUSSED, 0.8 W, THROUGH HOLE MOUNT, SIP
256CH753X2SR	VISHAY	获取价格	RESISTOR, NETWORK, FILM, ISOLATED, 0.8 W, THROUGH HOLE MOUNT, SIP
256CH913X2PD	VISHAY	获取价格	RESISTOR, NETWORK, FILM, BUSSED, 0.8 W, THROUGH HOLE MOUNT, SIP
256DCB112K2R	ILLINOISCAPACITOR	获取价格	Radial Leaded Metallized Polypropylene Film Capacitors
256DCB112K2R	CDE	获取价格	7.1 mΩ

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