Datasheet > 2512063016Z3

2512063016Z3

更新时间： 2022-12-29 20:39:05

品牌	Logo	应用领域
飞来 - FAIR-RITE		/
页数	文件大小	规格书
3页	1550K
描述
Chip Beads

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2512063016Z3 数据手册

Chip Beads (2512066017Y1)

Part Number: 2512066017Y1

MULTI- LAYER CHIP BEAD

Fair- Rite offers a broad selection of cost effective multi- layer chip beads to suppress conducted EMI signals. Chip beads can be

used in an array of devices such as cellular phones, computers, laptops, pagers, etc. The small package sizes accommodate

automated placements and allow for a dense packaging of circuit boards.

Chip Beads are available in standard, high and GHz signal speeds.

Recommended Soldering Profile

Packaging Options:

- All multi- layer chip beads are supplied taped and reeled, if required bulk packed chip beads can be provided.

The suggested land patterns are in accordance to the latest revision of IPC-7351.

Weight: 0.03 (g)

Package Size: 1206 (3216)

Dim mm mm tol

nominal inch

0.043

0.063

0.126

0.028

inch misc.

Reel Information

Tape Width Pitch

1.1 ±0.20

1.6 ±0.20

3.2 ±0.20

0.7 ±0.30

Parts 7"

Reel

Parts 13"

Reel

Parts 14"

Reel

3000

10000

Land Patterns

1.20

2.80

(0.110”)

1.80

(0.071”)

1.60

(0.063”)

(0.047”)

12 3

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2512063017H3	FAIR-RITE	Chip Beads	获取价格
2512063017Y0	FAIR-RITE	MULTI-LAYER CHIP BEAD	获取价格
2512063017Y0_18	FAIR-RITE	Chip Beads	获取价格
2512063017Y1	FAIR-RITE	Chip Beads	获取价格