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2512063018H0 PDF预览

2512063018H0

更新时间: 2024-11-21 00:31:19
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飞来 - FAIR-RITE /
页数 文件大小 规格书
3页 1550K
描述
Chip Beads

2512063018H0 数据手册

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Chip Beads (2512066017Y1)  
Part Number: 2512066017Y1  
MULTI- LAYER CHIP BEAD  
Fair- Rite offers a broad selection of cost effective multi- layer chip beads to suppress conducted EMI signals. Chip beads can be  
used in an array of devices such as cellular phones, computers, laptops, pagers, etc. The small package sizes accommodate  
automated placements and allow for a dense packaging of circuit boards.  
Chip Beads are available in standard, high and GHz signal speeds.  
Recommended Soldering Profile  
Packaging Options:  
- All multi- layer chip beads are supplied taped and reeled, if required bulk packed chip beads can be provided.  
The suggested land patterns are in accordance to the latest revision of IPC-7351.  
Weight: 0.03 (g)  
Package Size: 1206 (3216)  
Dim mm mm tol  
nominal inch  
0.043  
0.063  
0.126  
0.028  
inch misc.  
Reel Information  
Tape Width Pitch  
A
B
C
D
1.1 ±0.20  
1.6 ±0.20  
3.2 ±0.20  
0.7 ±0.30  
_
_
_
_
Parts 7"  
Reel  
Parts 13"  
Reel  
Parts 14"  
Reel  
mm  
mm  
8
4
3000  
10000  
_
Land Patterns  
V
1.20  
W
2.80  
(0.110”)  
X
1.80  
(0.071”)  
Y
1.60  
(0.063”)  
Z
_
(0.047”)