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2410SFV15.0FM/065-2

更新时间： 2024-11-28 00:47:27
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Surface-mount Fuses Fundamentals

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Surface-mount Fuses  
Fundamentals  
Overview  
TE Circuit Protection offers the widest selection of surface-mount  
fuses available for addressing a broad range of overcurrent  
protection applications. Helping to prevent costly damage and  
promote  
a safe environment for electronic and electrical  
equipment, our single-use chip fuses provide performance stability  
to support applications with current ratings from .5A up to 20A.  
TE Circuit Protection also offers the telecom FT600 fuse for  
telecommunications applications. This telecom fuse helps comply  
with North American overcurrent protection requirements,  
including Telcordia, GR-1089, TIA-968-A (formerly FCC Part 68),  
and UL60950 3rd edition.  
Multi-layer Design for Chip Fuses  
The multi-layer design has the benefit of exposing more
f
use  
element surface area to the glass-ceramic absorptio
n
m
at
e
rial.  
When the fuse elements open, there is more mat
e
rial for the  
vaporizing fuse metals to absorb into, resulting in a
v
ery
e
ff
i
ci
e
n
t  
and effective quenching of the fuse arc.  
Figure 1  
Glass/Cerami
c  
Substrat
e  
Multiple Fuse  
Elements  
Substrate Single Fuse Glass  
Material Element Coating  
Figure 1 compared the multi-layer design of our
S
F
F fuses with  
standard glass coated designs. The
g
las
s
coat
e
d design
s
rely on  
the coating on only one side of th
e
fuse elemen
t
t
o abs
o
rb th
e  
vaporizing fuse material when it o
p
ens. T
h
eref
o
r
e
,
t
here is m
u
c
h  
less absorption material available
t
o
a
b
so
r
b t
he
f
u
s
e
metal
s
.
T
h
e  
result can be prolonged arcing an
d
po
s
sible coati
n
g br
e
ac
h
.  
Multi-layer Design  
Single-layer Glass Coated Design  
Figu
r
e
2  
Fault Zones  
Figure 2 shows how the absorpt
i
on characteristi
c
s
of
t
he
two  
designs differ. The multi-layer design indicates a cle
a
n
s
e
p
ar
a
tio
n  
with the fuse element evenly diffusi
n
g into the surr
o
unding  
ceramic substrate. In the glass coated de
si
gn, the element  
diffusion takes place in a small porti
o
n o
f
the de
v
ice a
n
d is only  
absorbed by the glass material di
re
c
t
l
y
a
b
ove th
e
area of failure.  
11  
Multi-layer Design  
Single-layer Glass Coated Design  
Wire-In-Air Design for 241
0
SF
V
Fuses  
The 2410(6125) is a Wire-In-Air SMD
F
use which is very suitable  
for secondary level over current protection applications.  
Figure 3  
Glass fiber enforced  
epoxy body  
Figure 3 compared our straight wire element design 2410SFV  
fuses with normal corrugating wire design fuse. The straight wire  
element in air performs consistent fusing and cutting  
characteristics together with excellent inrush current  
withstanding capability.  
Straight wire element  
Copper terminal  
plated with Ni and Tin  
Introduced PCB assembly technology into 2410SFV fuses design  
and manufacture, we achieved on lead free completely and no  
end cap falling off risk comparing with traditional ceramic body  
with end cap fuse.  
Ceramic body  
Corrugate wire element  
End cap plated with Tin  
75  
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