20MT120UFAPbF
Vishay Semiconductors
"Full Bridge" IGBT MTP (Ultrafast NPT IGBT), 20 A
FEATURES
• Ultrafast Non Punch Through (NPT) technology
• Positive VCE(on) temperature coefficient
• 10 μs short circuit capability
• HEXFRED® antiparallel diodes with ultrasoft reverse
recovery
• Low diode VF
• Square RBSOA
• Al2O3 DBC substrate
MTP
• Very low stray inductance design for high speed operation
• UL approved file E78996
• Speed 8 kHz to 60 kHz
• Compliant to RoHS directive 2002/95/EC
• Designed and qualified for industrial level
PRODUCT SUMMARY
BENEFITS
VCES
1200 V
20 A
• Optimized for welding, UPS and SMPS applications
• Rugged with ultrafast performance
• Outstanding ZVS and hard switching operation
• Low EMI, requires less snubbing
• Excellent current sharing in parallel operation
• Direct mounting to heatsink
IC at TC = 96 °C
VCE(on) (typical)
at IC = 20 A, 25 °C
3.29 V
• PCB solderable terminals
• Very low junction to case thermal resistance
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
VCES
IC
TEST CONDITIONS
MAX.
1200
20
UNITS
Collector to emitter breakdown voltage
Continuous collector current
Pulsed collector current
V
TC = 96 °C
ICM
100
100
100
20
A
Clamped inductive load current
Diode maximum forward current
Gate to emitter voltage
ILM
IFM
VGE
V
RMS isolation voltage
VISOL
Any terminal to case, t = 1 minute
TC = 25 °C
2500
240
96
Maximum power dissipation (only IGBT)
PD
W
T
C = 100 °C
Document Number: 94470
Revision: 03-Aug-10
For technical questions within your region, please contact one of the following:
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
www.vishay.com
1