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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 2-2823558-4 | TE |
获取价格 |
RAIL D-SUB BACKSHELLS FOR D-SUBMINIATURE CONNECTORS |
|
| 2-2823558-5 | TE |
获取价格 |
RAIL D-SUB BACKSHELLS FOR D-SUBMINIATURE CONNECTORS |
|
| 2-2823558-6 | TE |
获取价格 |
RAIL D-SUB BACKSHELLS FOR D-SUBMINIATURE CONNECTORS |
|
| 2-2823558-7 | TE |
获取价格 |
RAIL D-SUB BACKSHELLS FOR D-SUBMINIATURE CONNECTORS |
|
| 2-2823558-8 | TE |
获取价格 |
RAIL D-SUB BACKSHELLS FOR D-SUBMINIATURE CONNECTORS |
|
| 2-2823558-9 | TE |
获取价格 |
RAIL D-SUB BACKSHELLS FOR D-SUBMINIATURE CONNECTORS |
|
| 228250508405 | VISHAY |
获取价格 |
CAPACITOR, CERAMIC, 50V, C0G, 0.000047uF, THROUGH HOLE MOUNT, RADIAL LEADED, ROHS COMPLIAN |
|
| 228250508444 | VISHAY |
获取价格 |
CAPACITOR, CERAMIC, 50V, C0G, 0.0000047uF, THROUGH HOLE MOUNT, RADIAL LEADED, ROHS COMPLIA |
|
| 228250508645 | VISHAY |
获取价格 |
CAPACITOR, CERAMIC, 50V, C0G, 0.0000068uF, THROUGH HOLE MOUNT, RADIAL LEADED, ROHS COMPLIA |
|
| 228250608304 | VISHAY |
获取价格 |
CAPACITOR, CERAMIC, 100V, C0G, 0.000033uF, THROUGH HOLE MOUNT, RADIAL LEADED, ROHS COMPLIA |
|
英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
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