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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 2-1776252-2 | MACOM |
获取价格 |
TERMINAL BLOCK 45 DEGREE WIRE INLET W/INTERLOCK, 5.0mm PITCH, HIGH TEMP |
|
| 2-1776252-3 | MACOM |
获取价格 |
TERMINAL BLOCK 45 DEGREE WIRE INLET W/INTERLOCK, 5.0mm PITCH, HIGH TEMP |
|
| 2-1776252-4 | MACOM |
获取价格 |
TERMINAL BLOCK 45 DEGREE WIRE INLET W/INTERLOCK, 5.0mm PITCH, HIGH TEMP |
|
| 2-1776275-0 | TE |
获取价格 |
TERMINAL BLOCK PCB MOUNT, STRAIGHT SIDE WIRE ENTRY, W/INTERLOCK 3.5mm PITCH, HIGH TEMP |
|
| 2-1776275-1 | TE |
获取价格 |
TERMINAL BLOCK PCB MOUNT, STRAIGHT SIDE WIRE ENTRY, W/INTERLOCK 3.5mm PITCH, HIGH TEMP |
|
| 2-1776275-2 | MACOM |
获取价格 |
TERMINAL BLOCK PCB MOUNT, STRAIGHT SIDE WIRE ENTRY, W/INTERLOCK 3.5mm PITCH, HIGH TEMP |
|
| 2-1776275-3 | MACOM |
获取价格 |
TERMINAL BLOCK PCB MOUNT, STRAIGHT SIDE WIRE ENTRY, W/INTERLOCK 3.5mm PITCH, HIGH TEMP |
|
| 2-1776275-4 | MACOM |
获取价格 |
TERMINAL BLOCK PCB MOUNT, STRAIGHT SIDE WIRE ENTRY, W/INTERLOCK 3.5mm PITCH, HIGH TEMP |
|
| 2-177648-3 | MACOM |
获取价格 |
Wire-to-Board, Wire-to-Panel and Wire-to-Wire |
|
| 2-177648-8 | MACOM |
获取价格 |
Wire-to-Board, Wire-to-Panel and Wire-to-Wire |
|
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
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