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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 2-102935-8 | MACOM |
获取价格 |
RECEPTACLE ASSEMBLY, LEVEL V, DOUBLE ROW, .125 X .125 CL, #26 - #22 AWG |
|
| 2102964-1 | TE |
获取价格 |
Crimping Die Assemblies and Supports for COPALUM Lite Sealed Terminals and Splices |
|
| 2102965-1 | TE |
获取价格 |
Crimping Die Assemblies and Supports for COPALUM Lite Sealed Terminals and Splices |
|
| 2102966-1 | TE |
获取价格 |
Crimping Die Assemblies and Supports for COPALUM Lite Sealed Terminals and Splices |
|
| 2102968-1 | TE |
获取价格 |
Crimping Die Assemblies and Supports for COPALUM Lite Sealed Terminals and Splices |
|
| 2102972-1 | TE |
获取价格 |
Crimping Die Assemblies and Supports for COPALUM Lite Sealed Terminals and Splices |
|
| 2102973-1 | TE |
获取价格 |
Crimping Die Assemblies and Supports for COPALUM Lite Sealed Terminals and Splices |
|
| 2102974-1 | TE |
获取价格 |
Crimping Die Assemblies and Supports for COPALUM Lite Sealed Terminals and Splices |
|
| 2-102976-0 | MACOM |
获取价格 |
HEADER ASSY, MOD II, BREAKAWAY, SINGLE ROW, 100 CL, VERTICAL, WITH .025 SQUARE POSTS |
|
| 2102976-1 | TE |
获取价格 |
Crimping Die Assemblies and Supports for COPALUM Lite Sealed Terminals and Splices |
|
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
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