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1N4752AUR-1TR

更新时间： 2024-11-20 13:55:31
品牌 Logo 应用领域
美高森美 - MICROSEMI 测试二极管
页数 文件大小 规格书
5页 141K
描述
Zener Diode, 33V V(Z), 5%, 1W, Silicon, Unidirectional, DO-213AB, HERMETIC SEALED, GLASS, MELF-2

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1N4752AUR-1TR 技术参数

是否无铅： 含铅是否Rohs认证： 不符合
生命周期：Active零件包装代码：DO-213AB
包装说明：O-LELF-R2针数：2
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8541.10.00.50风险等级：5.08
其他特性：HIGH RELIABILITY外壳连接：ISOLATED
配置：SINGLE二极管元件材料：SILICON
二极管类型：ZENER DIODEJEDEC-95代码：DO-213AB
JESD-30 代码：O-LELF-R2JESD-609代码：e0
湿度敏感等级：1元件数量：1
端子数量：2封装主体材料：GLASS
封装形状：ROUND封装形式：LONG FORM
峰值回流温度（摄氏度）：NOT SPECIFIED极性：UNIDIRECTIONAL
最大功率耗散：1 W认证状态：Not Qualified
标称参考电压：33 V表面贴装：YES
技术：ZENER端子面层：TIN LEAD
端子形式：WRAP AROUND端子位置：END
处于峰值回流温度下的最长时间：NOT SPECIFIED最大电压容差：5%
工作测试电流：7.5 mABase Number Matches：1

1N4752AUR-1TR 数据手册

 浏览型号1N4752AUR-1TR的Datasheet PDF文件第2页浏览型号1N4752AUR-1TR的Datasheet PDF文件第3页浏览型号1N4752AUR-1TR的Datasheet PDF文件第4页浏览型号1N4752AUR-1TR的Datasheet PDF文件第5页 
1N4728UR-1 thru 1N4764AUR-1,e3  
(or MLL4728A-1 thru MLL4764A-1,e3)  
METALLURGICALLY BONDED GLASS  
SURFACE MOUNT 1.0 W ZENERS  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
This surface mountable 1 watt Zener diode series is electrically equivalent to  
the 1N4728A thru 1N4764A registration in the DO-41 equivalent package  
except that it meets the JEDEC surface mount outline DO-213AB and also  
includes enhanced internal contact design. It is an ideal selection for  
applications of high density and low parasitic requirements for voltage  
regulation. Standard voltage tolerance is +/-5% with tighter tolerances  
available down to 1%. With its glass hermetic qualities, it may also be used  
for high reliability applications when required by a source control drawing  
(SCD).  
DO-213AB  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
•
Electrically similar to the JEDEC registered 1N4728  
thru 1N4764 zener series  
•
•
Regulates voltage over a broad operating current  
and temperature range  
•
•
Zener voltages available 3.3V to 100V  
Metallurgically enhanced internal contact design fro  
greater reliability and lower thermal resistance  
Standard voltage tolerances are +/- 5% with “A” suffix  
and 10 % with no suffix identification  
•
•
•
•
•
•
•
Wide selection from 3.3 to 100 V  
Leadless package for surface mounting  
Ideal for high density mounting  
•
•
Tight tolerances available in plus or minus 2% or 1%  
with C or D suffix respectively  
Options for screening in accordance with MIL-PRF-  
19500 for JAN, JANTX, JANTXV, and JANS are  
available by adding MQ, MX, MV, or MSP prefixes  
respectively to part numbers.  
Nonsensitive to ESD  
Hermetically sealed glass package  
Specified capacitance (see Figure 2)  
Inherently radiation hard per MicroNote 050  
•
Surface mount equivalents also available as  
SMAJ4728A to SMAJ4764A and SMAJ4728A to  
SMAJ4764A  
•
•
RoHS Compliant devices available by adding “e3” suffix  
Plastic body axial-leaded Zener equivalents are also  
available as 1N4728A to 1N4764A  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
•
Power dissipation at 25ºC: 1.0 watts (also see derating  
in Figure 1).  
•
•
CASE: Hermetically sealed DO-213AB glass MELF  
TERMINALS: Tin-Lead (Sn/Pb) or RohS Compliant  
annealed matte-Tin plating solderable per MIL-STD-  
750, method 2026  
•
•
Operating and Storage temperature: -65ºC to +175ºC  
Thermal Resistance: 40 ºC/W junction to end cap, or  
120ºC/W junction to ambient when mounted on FR4 PC  
board (1 oz Cu) with recommended footprint (see last  
page)  
•
POLARITY: Cathode indicated by band. Diode to  
be operated with the banded end positive with  
respect to the opposite end for Zener regulation  
•
Steady-State Power: 1.00 watts at TEC < 135oC, or  
1.00 watts at TA < 55ºC when mounted on FR4 PC  
board and recommended footprint as described for  
thermal resistance (also see Figure 1)  
•
•
MARKING: Cathode band only  
TAPE & REEL optional: Standard per EIA-481-B  
with 12 mm tape, 1500 per 7 inch reel or 5000 per  
13 inch reel (add “TR” suffix to part number)  
•
•
Forward voltage @200 mA: 1.2 volts (maximum)  
Solder Temperatures: 260 ºC for 10 s (max)  
•
•
WEIGHT: 0.05 grams  
See package dimensions & recommended mounting  
pad on last page  
Copyright © 2005  
10-18-2005 REV A  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  
12345

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